Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 3/20 | 0.62 |
| ▸ | APP | P05067 | 2/20 | 0.57 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.57 |
| ▸ | ASIC3 | Q9UHC3 | 2/20 | 0.56 |
| ▸ | PIK3CA | P42336 | 1/20 | 0.53 |
| ▸ | MTOR | P42345 | 1/20 | 0.53 |
| ▸ | PDK1 | Q15118 | 1/20 | 0.53 |
| ▸ | CA12 | O43570 | 1/20 | 0.52 |
| ▸ | CA1 | P00915 | 1/20 | 0.52 |
| ▸ | CA2 | P00918 | 1/20 | 0.52 |
| ▸ | CA9 | Q16790 | 1/20 | 0.52 |
| ▸ | MAOA | P21397 | 3/20 | 0.50 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.50 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.50 |
| ▸ | MEN1 | O00255 | 2/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.50 |
| ▸ | NPC1 | O15118 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.50 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.50 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2811255 | 1.00 | MAPT (0.62) | MAPTAPPFFAR1ASIC3PIK3CA | |
| Hydrochloric Acid SCHEMBL7919919 | 0.98 | MAPT (0.60) | MAPTAPPFFAR1ASIC3PIK3CA | |
| SCHEMBL9611202 | 0.93 | FFAR1 (0.59) | MAPTAPPFFAR1ASIC3PIK3CA | |
| SCHEMBL4968126 | 0.93 | CYP3A4 (0.58) | MAPTAPPFFAR1ASIC3PIK3CA | |
| SCHEMBL20717640 | 0.89 | MAPT (0.50) | MAPTAPPFFAR1ASIC3PIK3CA | |
| SCHEMBL9611201 | 0.88 | MAPT (0.67) | MAPTAPPFFAR1ASIC3PIK3CA | |
| SCHEMBL4970529 | 0.88 | MAPT (0.67) | MAPTAPPFFAR1ASIC3PIK3CA | |
| SCHEMBL18561138 | 0.83 | MAPT (0.65) | MAPTAPPFFAR1ASIC3MTOR | |
| SCHEMBL13717014 | 0.83 | MAPT (0.73) | MAPTAPPFFAR1ASIC3MTOR | |
| SCHEMBL2266577 | 0.83 | CYP3A4 (0.52) | MAPTFFAR1ASIC3PIK3CAMTOR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117555204-B | Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board | 明士(北京)新材料开发有限公司 | 2024-04-26 | — | — | CN | claimed |
| CN-117777444-A | Preparation of polyimide material with low thermal expansion coefficient and dielectric constant | 聚埃麦德(苏州)科技有限公司 | 2024-03-29 | — | — | CN | claimed |
| CN-117430812-B | Photosensitive polyamic acid ester resin, resin composition and application | 明士(北京)新材料开发有限公司 | 2024-03-19 | — | — | CN | claimed |
| CN-117555204-A | Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board | 明士(北京)新材料开发有限公司 | 2024-02-13 | — | — | CN | claimed |
| CN-117430812-A | Photosensitive polyamic acid ester resin, resin composition and application | 明士(北京)新材料开发有限公司 | 2024-01-23 | — | — | CN | claimed |
| CN-117384378-A | Photosensitive polyamic acid ester resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2024-01-12 | — | — | CN | claimed |
| CN-116577965-B | Negative photosensitive solid adhesive film and preparation method thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-116577965-A | Negative photosensitive solid adhesive film and preparation method thereof | 明士(北京)新材料开发有限公司 | 2023-08-11 | — | — | CN | claimed |
| CN-115407610-B | Photosensitive resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-05-16 | — | — | CN | claimed |
| CN-115160569-B | Photosensitive polyamic acid ester resin, resin composition and electronic component | 明士(北京)新材料开发有限公司 | 2022-12-27 | — | — | CN | claimed |
| CN-115437218-A | Photosensitive resin with symmetrical and asymmetrical structures and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-12-06 | — | — | CN | claimed |
| CN-115407610-A | Photosensitive resin composition and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-11-29 | — | — | CN | claimed |
| CN-115160569-A | Photosensitive polyamic acid ester resin, resin composition and electronic component | 明士(北京)新材料开发有限公司 | 2022-10-11 | — | — | CN | claimed |
| CN-114395364-A | High-temperature-resistant polyimide structure adhesive and application thereof | 中国科学院化学研究所 | 2022-04-26 | — | — | CN | claimed |
| CN-114230792-A | Positive photosensitive polyimide resin, resin composition, and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-03-25 | — | — | CN | claimed |
| CN-119306730-A | Cyclic ether modified 3-cyano-4-arylaminoquinoline derivative as well as preparation method and application thereof | 河北医科大学 | 2025-01-14 | — | — | CN | disclosed |
| CN-117555204-B | Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board | 明士(北京)新材料开发有限公司 | 2024-04-26 | — | — | CN | disclosed |
| CN-115407609-A | Negative photosensitive resin composition for alkaline water system development and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-11-29 | — | — | CN | disclosed |
| CN-115236938-A | Negative photosensitive polyamic acid ester resin composition and use thereof | 明士(北京)新材料开发有限公司 | 2022-10-25 | — | — | CN | disclosed |
| CN-114395364-A | High-temperature-resistant polyimide structure adhesive and application thereof | 中国科学院化学研究所 | 2022-04-26 | — | — | CN | disclosed |