Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 2/20 | 0.58 |
| ▸ | TSHR | P16473 | 5/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.49 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.49 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.37 |
| ▸ | MEN1 | O00255 | 2/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | GAA | P10253 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | RHOA | P61586 | 1/20 | 0.36 |
| ▸ | PKM | P14618 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | CA1 | P00915 | 1/20 | 0.34 |
| ▸ | CA2 | P00918 | 1/20 | 0.34 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.34 |
| ▸ | TP53 | P04637 | 1/20 | 0.34 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.34 |
| ▸ | LIG1 | P18858 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30305035 | 0.90 | CYP3A4 (0.55) | CYP3A4TSHRALDH1A1HSD17B10KDM4E | |
| SCHEMBL29651817 | 0.88 | CYP3A4 (0.45) | CYP3A4TSHRALDH1A1HSD17B10KDM4E | |
| Phthalic Acid SCHEMBL25209633 | 0.87 | ALDH1A1 (0.42) | CYP3A4TSHRALDH1A1HSD17B10KMT2A | |
| Phthalic Acid SCHEMBL27575179 | 0.87 | ALDH1A1 (0.42) | CYP3A4TSHRALDH1A1HSD17B10KMT2A | |
| Phthalic Acid SCHEMBL28467885 | 0.87 | ALDH1A1 (0.42) | CYP3A4TSHRALDH1A1HSD17B10KMT2A | |
| SCHEMBL11698437 | 0.85 | APP (0.39) | CYP3A4TSHRALDH1A1HSD17B10KDM4E | |
| SCHEMBL11698445 | 0.85 | APP (0.39) | CYP3A4TSHRALDH1A1HSD17B10KDM4E | |
| SCHEMBL18915 | 0.84 | GAA (0.38) | TSHRALDH1A1HSD17B10KDM4EKMT2A | |
| Phthalic Acid SCHEMBL31412848 | 0.83 | ALDH1A1 (0.39) | CYP3A4TSHRALDH1A1HSD17B10KDM4E | |
| Water SCHEMBL3696709 | 0.83 | GAA (0.37) | TSHRALDH1A1HSD17B10KDM4EKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122071610-A | Resin composition and use thereof | 台燿科技股份有限公司 | 2026-05-22 | — | — | CN | disclosed |
| CN-119998243-A | Glass substrate for reinforcing wiring substrate | 日本电气硝子株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-115806735-B | Resin material and metal substrate | 南亚塑胶工业股份有限公司 | 2025-04-29 | — | — | CN | disclosed |
| CN-119859358-A | Resin composition and use thereof | 台燿科技股份有限公司 | 2025-04-22 | — | — | CN | disclosed |
| CN-119823516-A | Polymer composite material, method of using the same, low dielectric resin composition, prepreg, and metal foil laminate | 李长荣化学工业股份有限公司 | 2025-04-15 | — | — | CN | disclosed |
| CN-114437532-B | Circuit substrate material, prepreg base material and circuit substrate | 南亚塑胶工业股份有限公司 | 2025-03-04 | — | — | CN | disclosed |
| CN-119431770-A | Modified polyphenylene ether resin, method for preparing the same, and resin composition comprising the same | 南亚塑胶工业股份有限公司 | 2025-02-14 | — | — | CN | disclosed |
| CN-119144093-A | Resin composition | 南亚塑胶工业股份有限公司 | 2024-12-17 | — | — | CN | disclosed |
| CN-118742684-A | Solid state process for treating synthetic thermoplastic articles | 绿色主题技术股份有限公司 | 2024-10-01 | — | — | CN | disclosed |
| CN-115701443-B | High dielectric rubber resin material and high dielectric metal substrate | 南亚塑胶工业股份有限公司 | 2024-07-09 | — | — | CN | disclosed |
| CN-115716981-A | Resin composition | 南亚塑胶工业股份有限公司 | 2023-02-28 | — | — | CN | disclosed |
| CN-111285980-B | Halogen-free low dielectric resin composition, prepreg, metal foil laminate and printed wiring board using the same | 台燿科技股份有限公司 | 2023-02-28 | — | — | CN | disclosed |
| CN-115701443-A | High dielectric rubber resin material and high dielectric metal substrate | 南亚塑胶工业股份有限公司 | 2023-02-10 | — | — | CN | disclosed |
| CN-115701445-A | Low dielectric rubber resin material and low dielectric metal substrate | 南亚塑胶工业股份有限公司 | 2023-02-10 | — | — | CN | disclosed |
| CN-115701442-A | High-thermal-conductivity rubber resin material and high-thermal-conductivity metal substrate | 南亚塑胶工业股份有限公司 | 2023-02-10 | — | — | CN | disclosed |
| CN-111094437-B | Uncrosslinked rubber composition, rubber product produced using the same, and method for producing the same | 三菱电线工业株式会社 | 2022-05-13 | — | — | CN | disclosed |
| CN-114437532-A | Circuit board material, prepreg and circuit board | 南亚塑胶工业股份有限公司 | 2022-05-06 | — | — | CN | disclosed |
| CN-110862668-B | Halogen-free low dielectric resin composition, and prepreg, metal foil laminate and printed wiring board manufactured using the same | 台燿科技股份有限公司 | 2022-05-06 | — | — | CN | disclosed |
| CN-109119380-B | Electronic circuit package using composite magnetic encapsulant | TDK株式会社 | 2022-04-05 | — | — | CN | disclosed |
| CN-114080115-A | Method for manufacturing wiring substrate | 丰田自动车株式会社 | 2022-02-22 | — | — | CN | disclosed |