SCHEMBL29475149

SCHEMBL29475149

O=C(O)c1ccc(Oc2ccc(-c3ccc(Oc4ccc(C(=O)O)c(C(=O)O)c4)cc3)cc2)cc1C(=O)O

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 3/20 0.67
TDP1 Q9NUW8 3/20 0.57
MCL1 Q07820 2/20 0.57
GALK1 P51570 1/20 0.57
CASP6 P55212 1/20 0.57
PLEC Q15149 1/20 0.57
ALDH1A1 P00352 1/20 0.56
L3MBTL1 Q9Y468 2/20 0.53
APEX1 P27695 1/20 0.53
CTDSP1 Q9GZU7 1/20 0.53
HPSE Q9Y251 1/20 0.53
LMNA P02545 1/20 0.51
SMN1; SMN2 Q16637 1/20 0.47
PYGL P06737 2/20 0.46
PYGM P11217 1/20 0.46
MEN1 O00255 1/20 0.45
KMT2A Q03164 1/20 0.45
XDH P47989 4/20 0.44
SLC22A12 Q96S37 2/20 0.44
AKR1C3 P42330 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL278193 1.00 POLB (0.67) POLBTDP1MCL1GALK1CASP6
SCHEMBL8652192 0.94 POLB (0.71) POLBTDP1MCL1GALK1CASP6
SCHEMBL29406842 0.94 POLB (0.73) POLBTDP1MCL1GALK1CASP6
SCHEMBL262311 0.94 POLB (0.73) POLBTDP1MCL1GALK1CASP6
SCHEMBL30901880 0.94 POLB (0.73) POLBTDP1MCL1GALK1CASP6
SCHEMBL30553345 0.94 POLB (0.73) POLBTDP1MCL1GALK1CASP6
SCHEMBL145176 0.94 POLB (0.73) POLBTDP1MCL1GALK1CASP6
SCHEMBL29155507 0.93 POLB (0.69) POLBTDP1MCL1GALK1CASP6
SCHEMBL30636807 0.93 POLB (0.69) POLBTDP1MCL1GALK1CASP6
SCHEMBL1565048 0.92 POLB (0.57) POLBTDP1MCL1GALK1CASP6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250189891-A1 POLYIMIDE RESIN PRECURSOR TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
CN-117043231-A Polyamic acid composition, polyimide composition, adhesive, and laminate 三井化学株式会社 2023-11-10 CN disclosed
WO-2023074534-A1 POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE 三井化学株式会社 2023-05-04 WO disclosed
CN-109021236-B Polyimide or poly (amide-imide) film, display device including the same, and method of preparing the same 三星电子株式会社 2022-09-30 CN disclosed
CN-115073732-A Block type photosensitive polyimide precursor resin, preparation method thereof and block type photosensitive resin composition 波米科技有限公司 2022-09-20 CN disclosed
CN-114437350-B Polyimide resin and preparation method and application thereof 波米科技有限公司 2022-09-16 CN disclosed
CN-114805810-A Photosensitive polyimide precursor resin, preparation method thereof and photosensitive resin composition 波米科技有限公司 2022-07-29 CN disclosed
CN-114437350-A Polyimide resin and preparation method and application thereof 波米科技有限公司 2022-05-06 CN disclosed
CN-109563282-B Medical film and method for producing same, medical coating composition, medical device and method for producing same 三井化学株式会社 2022-04-15 CN disclosed
CN-114207522-A Negative photosensitive resin composition, method for producing polyimide, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-03-18 CN disclosed
CN-110431483-B Photosensitive resin composition and application thereof 律胜科技股份有限公司 2022-02-11 CN disclosed