⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11767508 | 0.75 | DPP4 (0.42) | — | |
| SCHEMBL4594104 | 0.73 | — | — | |
| SCHEMBL9789288 | 0.72 | — | — | |
| SCHEMBL28492293 | 0.70 | — | — | |
| SCHEMBL10500466 | 0.68 | — | — | |
| SCHEMBL9488849 | 0.67 | — | — | |
| SCHEMBL17748327 | 0.67 | ALDH1A1 (0.34) | — | |
| SCHEMBL4814286 | 0.67 | ALDH1A1 (0.34) | — | |
| SCHEMBL282872 | 0.66 | — | — | |
| SCHEMBL379767 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 98 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12068170-B2 | Vapor phase thermal etch solutions for metal oxo photoresists | APPLIED MATERIALS, INC. (US) | 2024-08-20 | — | — | US | claimed |
| US-12033866-B2 | Vapor phase thermal etch solutions for metal oxo photoresists | APPLIED MATERIALS, INC. (US) | 2024-07-09 | — | — | US | claimed |
| CN-117924207-A | Epoxy resin flexible film with high glass transition temperature | 中国科学院深圳先进技术研究院 | 2024-04-26 | — | — | CN | claimed |
| CN-117111418-A | Vapor phase thermal etching solution for metal oxo-photoresist | 应用材料公司 | 2023-11-24 | — | — | CN | claimed |
| EP-4267591-A2 | ORGANOMETALLIC COMPOUNDS | Umicore AG & Co. KG (DE) | 2023-11-01 | — | — | EP | claimed |
| CN-116802187-A | Organometallic compounds | 优米科尔股份公司及两合公司 | 2023-09-22 | — | — | CN | claimed |
| US-20230290646-A1 | VAPOR PHASE THERMAL ETCH SOLUTIONS FOR METAL OXO PHOTORESISTS | APPLIED MATERIALS, INC. | 2023-09-14 | — | — | US | claimed |
| US-20230215736-A1 | VAPOR PHASE THERMAL ETCH SOLUTIONS FOR METAL OXO PHOTORESISTS | APPLIED MATERIALS, INC. | 2023-07-06 | — | — | US | claimed |
| CN-115777086-A | Gas phase thermal etching liquid for metal oxo-photoresist | 应用材料公司 | 2023-03-10 | — | — | CN | claimed |
| WO-2022136049-A2 | ORGANOMETALLIC COMPOUNDS | UMICORE AG & CO. KG (DE) | 2022-06-30 | — | — | WO | claimed |
| US-20220002882-A1 | VAPOR PHASE THERMAL ETCH SOLUTIONS FOR METAL OXO PHOTORESISTS | APPLIED MATERIALS, INC. | 2022-01-06 | — | — | US | claimed |
| WO-2022005808-A1 | VAPOR PHASE THERMAL ETCH SOLUTIONS FOR METAL OXO PHOTORESISTS | APPLIED MATERIALS, INC. (US) | 2022-01-06 | — | — | WO | claimed |
| US-20050009922-A1 | Stable aqueous antimicrobial suspension | CARLSON PAUL E (US) | 2005-01-13 | — | — | US | claimed |
| US-20020147235-A1 | Stable aqueous antimicrobial suspension | VERICHEM, INC. | 2002-10-10 | — | — | US | claimed |
| WO-2002058629-A2 | STABLE AQUEOUS ANTIMICROBIAL SUSPENSION | VERICHEM, INC. (US) | 2002-08-01 | — | — | WO | claimed |
| EP-0285209-B1 | SUSTAINED RELEASE MICROBIOLOGICAL CONTROL COMPOSITION AND METHOD FOR BIOLOGICAL CONTROL USING SAID COMPOSITION | THE DOW CHEMICAL COMPANY (US) | 1993-05-05 | — | — | EP | claimed |
| US-4800082-A | HALOGENATED AMIDE AND HYDROPHILIC POLYMER | THE DOW CHEMICAL COMPANY (US) | 1989-01-24 | — | — | US | claimed |
| EP-0285209-A2 | Sustained release microbiological control composition and method for biological control using said composition | THE DOW CHEMICAL COMPANY (US) | 1988-10-05 | — | — | EP | claimed |
| JP-55108899-A | — | — | None | — | — | JP | disclosed |
| US-4163797-A | CARBAMOYL OR SULFAMOYL STABILIZER | THE DOW CHEMICAL COMPANY (US) | 1979-08-07 | — | — | US | disclosed |