⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17443 | 0.96 | — | — | |
| SCHEMBL6118114 | 0.96 | ALOX15 (1.00) | — | |
| SCHEMBL28504669 | 0.93 | — | — | |
| SCHEMBL28504671 | 0.93 | — | — | |
| SCHEMBL28429380 | 0.93 | — | — | |
| SCHEMBL28681717 | 0.93 | — | — | |
| Potassium SCHEMBL31030244 | 0.93 | — | — | |
| SCHEMBL28509867 | 0.93 | — | — | |
| SCHEMBL28496883 | 0.93 | — | — | |
| Water SCHEMBL28774239 | 0.93 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115004357-A | Resin composition for sealing, electronic component device, and method for manufacturing electronic component device | 昭和电工材料株式会社 | 2022-09-02 | — | — | CN | disclosed |
| CN-114981353-A | Resin composition for molding and electronic component device | 昭和电工材料株式会社 | 2022-08-30 | — | — | CN | disclosed |
| CN-114945618-A | Epoxy resin composition for transfer molding, process for producing the same, epoxy resin composition for compression molding, and electronic component device | 昭和电工材料株式会社 | 2022-08-26 | — | — | CN | disclosed |
| CN-114599729-A | Epoxy resin composition, electronic component device, and method for manufacturing electronic component device | 昭和电工材料株式会社 | 2022-06-07 | — | — | CN | disclosed |
| CN-114402029-A | Sealing material for compression molding and electronic component device | 昭和电工材料株式会社 | 2022-04-26 | — | — | CN | disclosed |