SCHEMBL29484558

SCHEMBL29484558

O=S(=O)(O)CCC[n+]1ccccc1O

nearest known ligand 0.37

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ NPC1 O15118 1/20 0.37
▸ POLB P06746 1/20 0.37
▸ RAB9A P51151 1/20 0.37
▸ SMN1; SMN2 Q16637 1/20 0.37
▸ KDM4E B2RXH2 1/20 0.36
▸ ALDH1A1 P00352 1/20 0.36
▸ RXFP1 Q9HBX9 1/20 0.36
▸ BCHE P06276 11/20 0.34
▸ ACHE P22303 11/20 0.34
▸ PABPC1 P11940 1/20 0.33
▸ EIF4H Q15056 1/20 0.33
▸ CTDSP1 Q9GZU7 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9171403 0.81 SMN1; SMN2 (0.61) NPC1POLBRAB9ASMN1; SMN2KDM4E
SCHEMBL29559022 0.81 SMN1; SMN2 (0.61) NPC1POLBRAB9ASMN1; SMN2KDM4E
SCHEMBL31231151 0.81 SMN1; SMN2 (0.36) NPC1POLBRAB9ASMN1; SMN2KDM4E
SCHEMBL16786136 0.80 NPC1 (0.39) NPC1POLBRAB9ASMN1; SMN2KDM4E
SCHEMBL29558509 0.80 NPC1 (0.39) NPC1POLBRAB9ASMN1; SMN2KDM4E
Water SCHEMBL6514539 0.80 SMN1; SMN2 (0.59) NPC1POLBRAB9ASMN1; SMN2KDM4E
SCHEMBL150282 0.78 HDAC8 (0.42) NPC1POLBRAB9ASMN1; SMN2KDM4E
SCHEMBL29461432 0.78 HDAC8 (0.42) NPC1POLBRAB9ASMN1; SMN2KDM4E
SCHEMBL1922194 0.77 BCHE (0.66) BCHEACHE
SCHEMBL31305314 0.77 BCHE (0.66) BCHEACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250243596-A1 Composition and Method for Fabrication of Nickel Interconnects MACDERMID ENTHONE INC. 2025-07-31 — — US disclosed
US-12270121-B2 Composition and method for fabrication of nickel interconnects MACDERMID ENTHONE INC. (US) 2025-04-08 — — US disclosed
US-20220064811-A1 Composition and Method for Fabrication of Nickel Interconnects MACDERMID ENTHONE INC. 2022-03-03 — — US disclosed
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