SCHEMBL2948933

SCHEMBL2948933

C=C(C(=O)O)C(O)(O)C(C)(C)C

nearest known ligand 0.39

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TET2 Q6N021 1/20 0.39
ALDH1A1 P00352 1/20 0.38
TSHR P16473 1/20 0.38
HMGCR P04035 1/20 0.32
CHRM1 P11229 1/20 0.32
TBXA2R P21731 1/20 0.32
ADRA1A P35348 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9056366 0.77 TET2 (0.32) TET2
SCHEMBL4652781 0.77
SCHEMBL6757384 0.77
SCHEMBL2137763 0.73 TET2 (0.39) TET2ALDH1A1TSHRHMGCRCHRM1
SCHEMBL23950 0.73
SCHEMBL9746099 0.71
SCHEMBL7266032 0.70 TET2 (0.33) TET2ALDH1A1TSHR
SCHEMBL15156787 0.70 TET2 (0.38) TET2ALDH1A1TSHR
SCHEMBL5464430 0.69 ALDH1A1 (0.56) TET2ALDH1A1TSHRHMGCRCHRM1
SCHEMBL3102112 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7655174-B2 Combination of high viscosity and slower acting low viscosity resins, curable toughener, initiator and stabilizer; rapid homogeneous droplet merging and curing; tensile strength, ductility; computer controlled piezoelectric printing of three dimensional multilayer articles HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) 2010-02-02 US disclosed
US-20050171237-A1 Combination of high viscosity and slower acting low viscosity resins, curable toughener, initiator and stabilizer; rapid homogeneous droplet merging and curing; tensile strength, ductility; computer controlled piezoelectric printing of three dimensional multilayer articles 3D SYSTEMS, INC. 2005-08-04 US disclosed