SCHEMBL2950697

SCHEMBL2950697

CC(C)C[Si](CC(C)C)(OC(C)(C)C)OC(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5833996 0.87
SCHEMBL2947523 0.78
SCHEMBL2399341 0.78
SCHEMBL9159658 0.72
SCHEMBL5833227 0.69
SCHEMBL23149 0.67
SCHEMBL429653 0.67
SCHEMBL16705794 0.65 TSHR (0.33)
SCHEMBL25262297 0.65
SCHEMBL2947516 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117069942-A Polysiloxane compound, composition for forming film, laminate, touch panel, and method for forming cured film 阪田油墨株式会社 2023-11-17 CN disclosed
CN-117075425-A Polysiloxane composition, composition for forming film, laminate, touch panel, and method for forming cured film 阪田油墨株式会社 2023-11-17 CN disclosed
CN-114430767-B Composition for forming film, laminate coated with the composition, touch panel using the laminate, and method for forming cured film 阪田油墨株式会社 2023-04-28 CN disclosed
CN-115145113-A Composition for forming coating, laminate coated with same, fingerprint authentication sensor using laminate, and method for forming cured coating 阪田油墨株式会社 2022-10-04 CN disclosed
CN-112955514-B Composition for forming coating film, glass substrate coated with the composition, and touch panel using the glass substrate 阪田油墨株式会社 2022-09-06 CN disclosed
CN-114430767-A Composition for forming coating, laminate coated with the composition, touch panel using the laminate, and method for forming cured coating 阪田油墨株式会社 2022-05-03 CN disclosed
CN-112955514-A Composition for forming coating film, glass substrate coated with the composition, and touch panel using the glass substrate 阪田油墨株式会社 2021-06-11 CN disclosed
WO-2021065211-A1 COATING FILM-FORMING COMPOSITION, LAMINATE OBTAINED BY COATING SAID COATING FILM-FORMING COMPOSITION, TOUCH PANEL OBTAINED BY USING SAID LAMINATE, AND METHOD FOR FORMING CURED COATING FILM サカタインクス株式会社 2021-04-08 WO disclosed
US-20100283133-A1 FILM-FORMING COMPOSITION, INSULATING FILM WITH LOW DIELECTRIC CONSTANT, FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE HAMADA YOSHITAKA 2010-11-11 US disclosed
US-20100233482-A1 Organic silicon oxide fine particles and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device HAMADA YOSHITAKA 2010-09-16 US disclosed
US-7786022-B2 Method for forming insulating film with low dielectric constant SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-08-31 US disclosed
US-20100210765-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION, PRODUCTION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME, AND ADDITIVE FOR RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-08-19 US disclosed
US-7754330-B2 Organic silicon oxide core-shell particles and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-07-13 US disclosed
US-20090294726-A1 ORGANIC SILICON OXIDE FINE PARTICLES AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-12-03 US disclosed
US-20090294922-A1 ORGANIC SILICON OXIDE FINE PARTICLE AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE PANASONIC CORPORATION (JP) 2009-12-03 US disclosed
EP-1999167-A2 ZIEGLER-NATTA CATALYST WITH IN SITU-GENERATED DONOR Novolen Technology Holdings, C.V. (NL) 2008-12-10 EP disclosed
US-20080290521-A1 FILM-FORMING COMPOSITION, INSULATING FILM WITH LOW DIELECTRIC CONSTANT, FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE SHIN ETSU CHEMICAL CO., LTD. 2008-11-27 US disclosed
US-20080292863-A1 SILOXANE POLYMER, PREPARATION METHOD THEREOF, POROUS-FILM FORMING COATING SOLUTION CONTAINING THE POLYMER, POROUS FILM, AND SEMICONDUCTOR DEVICE USING THE POROUS FILM SHIN ETSU CHEMICAL CO., LTD. 2008-11-27 US disclosed
WO-2007106348-A2 ZIEGLER-NATTA CATALYST WITH IN SITU-GENERATED DONOR NOVOLEN TECHNOLOGY HOLDINGS C.V. (NL) 2007-09-20 WO disclosed
US-20070213204-A1 Ziegler-Natta catalyst with in situ-generated donor NOVOLEN TECHNOLOGY HOLDINGS C.V. 2007-09-13 US disclosed