Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC1 | Q13547 | 3/20 | 0.64 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.55 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.55 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.55 |
| ▸ | KCNMA1 | Q12791 | 3/20 | 0.51 |
| ▸ | MEN1 | O00255 | 2/20 | 0.51 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.51 |
| ▸ | PABPC1 | P11940 | 1/20 | 0.51 |
| ▸ | DUSP3 | P51452 | 1/20 | 0.51 |
| ▸ | PTPN5 | P54829 | 1/20 | 0.51 |
| ▸ | PTPN11 | Q06124 | 1/20 | 0.51 |
| ▸ | EIF4H | Q15056 | 1/20 | 0.51 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.51 |
| ▸ | RAB9A | P51151 | 3/20 | 0.50 |
| ▸ | NPC1 | O15118 | 2/20 | 0.50 |
| ▸ | MAPT | P10636 | 2/20 | 0.50 |
| ▸ | KDM4C | Q9H3R0 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.49 |
| ▸ | LMNA | P02545 | 2/20 | 0.49 |
| ▸ | PRMT1 | Q99873 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16424442 | 1.00 | HDAC1 (0.64) | HDAC1SMN1; SMN2NPSR1HSD17B10KCNMA1 | |
| SCHEMBL20445882 | 0.95 | HDAC1 (0.59) | HDAC1SMN1; SMN2NPSR1HSD17B10KCNMA1 | |
| SCHEMBL22642141 | 0.89 | HDAC1 (0.53) | HDAC1SMN1; SMN2NPSR1HSD17B10KCNMA1 | |
| SCHEMBL14088959 | 0.86 | HDAC1 (0.74) | HDAC1SMN1; SMN2NPSR1HSD17B10KCNMA1 | |
| SCHEMBL13601066 | 0.85 | HDAC1 (0.60) | HDAC1KCNMA1MEN1KMT2ACTDSP1 | |
| SCHEMBL12510752 | 0.84 | HDAC1 (0.63) | HDAC1KCNMA1MEN1KMT2APABPC1 | |
| SCHEMBL19846842 | 0.84 | KMT2A (0.60) | SMN1; SMN2KCNMA1MEN1KMT2APABPC1 | |
| SCHEMBL29513264 | 0.82 | HDAC1 (0.69) | HDAC1SMN1; SMN2NPSR1HSD17B10KCNMA1 | |
| SCHEMBL16444873 | 0.82 | HDAC1 (0.69) | HDAC1SMN1; SMN2NPSR1HSD17B10KCNMA1 | |
| SCHEMBL18360435 | 0.82 | HDAC1 (0.69) | HDAC1SMN1; SMN2NPSR1HSD17B10KCNMA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250189891-A1 | POLYIMIDE RESIN PRECURSOR | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-06-12 | — | — | US | disclosed |
| WO-2025100308-A1 | RESIN COMPOSITION, CURED PRODUCT, AND DISPLAY DEVICE OR SEMICONDUCTOR DEVICE | 東レ株式会社 | 2025-05-15 | — | — | WO | disclosed |
| CN-112368641-B | Photosensitive resin composition, photosensitive sheet, cured film thereof, method for producing cured film, and electronic component | 东丽株式会社 | 2025-05-02 | — | — | CN | disclosed |
| CN-118900872-A | Polyimide resin precursor | 东京应化工业株式会社 | 2024-11-05 | — | — | CN | disclosed |
| CN-118749013-A | Resin composition, cured product, electronic component, and display device | 东丽株式会社 | 2024-10-08 | — | — | CN | disclosed |
| WO-2023233896-A1 | PHOTOSENSITIVE RESIN COMPOSITION | 東京応化工業株式会社 | 2023-12-07 | — | — | WO | disclosed |
| WO-2023233895-A1 | POLYIMIDE RESIN PRECURSOR | 東京応化工業株式会社 | 2023-12-07 | — | — | WO | disclosed |
| CN-116997858-A | Negative photosensitive resin composition, negative photosensitive resin composition film, cured product, method for producing cured product, hollow structure, and electronic component | 东丽株式会社 | 2023-11-03 | — | — | CN | disclosed |
| CN-116802559-A | Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound | 东丽株式会社 | 2023-09-22 | — | — | CN | disclosed |
| WO-2023176172-A1 | POLYIMIDE RESIN PRECURSOR | 東京応化工業株式会社 | 2023-09-21 | — | — | WO | disclosed |
| WO-2023080007-A1 | POLYIMIDE PRODUCTION METHOD, POLYIMIDE, POLYIMIDE RESIN COMPOSITION, AND CURED PRODUCT THEREOF | 東レ株式会社 | 2023-05-11 | — | — | WO | disclosed |
| WO-2023058385-A1 | BLOCK COPOLYMER | 東京応化工業株式会社 | 2023-04-13 | — | — | WO | disclosed |
| CN-111051432-B | Resin composition, method for producing resin film, and method for producing electronic device | 东丽株式会社 | 2023-04-04 | — | — | CN | disclosed |
| WO-2022202486-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, PREPARATION METHOD OF CURED PRODUCT, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT | 東レ株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022163335-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND | 東レ株式会社 | 2022-08-04 | — | — | WO | disclosed |
| CN-114207520-A | Photosensitive resin composition, photosensitive sheet, cured film, method for producing cured film, interlayer insulating film, and electronic component | 东丽株式会社 | 2022-03-18 | — | — | CN | disclosed |