Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC1 | Q13547 | 3/20 | 0.60 |
| ▸ | MAPT | P10636 | 2/20 | 0.60 |
| ▸ | RAB9A | P51151 | 1/20 | 0.60 |
| ▸ | CA1 | P00915 | 4/20 | 0.56 |
| ▸ | CA2 | P00918 | 4/20 | 0.56 |
| ▸ | CA12 | O43570 | 3/20 | 0.56 |
| ▸ | CA9 | Q16790 | 3/20 | 0.56 |
| ▸ | PRMT1 | Q99873 | 3/20 | 0.55 |
| ▸ | SETD7 | Q8WTS6 | 1/20 | 0.52 |
| ▸ | NPC1 | O15118 | 1/20 | 0.49 |
| ▸ | CASP6 | P55212 | 1/20 | 0.48 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.48 |
| ▸ | MEN1 | O00255 | 1/20 | 0.47 |
| ▸ | LMNA | P02545 | 1/20 | 0.47 |
| ▸ | POLB | P06746 | 1/20 | 0.47 |
| ▸ | PKM | P14618 | 1/20 | 0.47 |
| ▸ | APEX1 | P27695 | 1/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.47 |
| ▸ | GAA | P10253 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18360221 | 0.91 | HDAC1 (0.57) | HDAC1MAPTRAB9ACA1CA2 | |
| SCHEMBL20445882 | 0.91 | HDAC1 (0.59) | HDAC1MAPTRAB9ACA1CA2 | |
| SCHEMBL15998582 | 0.90 | HDAC1 (0.51) | HDAC1MAPTRAB9ACA1CA2 | |
| SCHEMBL14228242 | 0.87 | MAPT (0.58) | HDAC1MAPTRAB9ACA1CA2 | |
| SCHEMBL2605546 | 0.85 | KCNMA1 (0.61) | HDAC1MAPTRAB9ACA1CA2 | |
| SCHEMBL12510752 | 0.85 | HDAC1 (0.63) | HDAC1MAPTRAB9ACA1CA2 | |
| SCHEMBL16424442 | 0.85 | HDAC1 (0.64) | HDAC1MAPTRAB9ACA1CA2 | |
| SCHEMBL29513367 | 0.85 | HDAC1 (0.64) | HDAC1MAPTRAB9ACA1CA2 | |
| SCHEMBL2605585 | 0.84 | HDAC1 (0.70) | HDAC1MAPTRAB9ACA1CA2 | |
| SCHEMBL10630369 | 0.84 | HDAC1 (0.53) | HDAC1MAPTRAB9ACA1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 97 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4660705-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RELIEF PATTERN USING SAME, CURED ARTICLE AND ELECTRONIC COMPONENT | Toray Industries, Inc. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4651186-A1 | METHOD FOR PRODUCING MULTILAYER BODY, AND RESIN COMPOSITION | Toray Industries, Inc. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4651185-A1 | LAMINATE, SEMICONDUCTOR ELEMENT, AND MEMS ELEMENT | Toray Industries, Inc. (JP) | 2025-11-19 | — | — | EP | disclosed |
| US-20250321481-A1 | PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-10-16 | — | — | US | disclosed |
| US-20250199401-A1 | RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, AND DISPLAY DEVICE | TORAY INDUSTRIES, INC. (JP) | 2025-06-19 | — | — | US | disclosed |
| US-20250189891-A1 | POLYIMIDE RESIN PRECURSOR | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-06-12 | — | — | US | disclosed |
| WO-2025100308-A1 | RESIN COMPOSITION, CURED PRODUCT, AND DISPLAY DEVICE OR SEMICONDUCTOR DEVICE | 東レ株式会社 | 2025-05-15 | — | — | WO | disclosed |
| CN-112368641-B | Photosensitive resin composition, photosensitive sheet, cured film thereof, method for producing cured film, and electronic component | 东丽株式会社 | 2025-05-02 | — | — | CN | disclosed |
| WO-2025074871-A1 | RESIN, PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCTS OF SAME, AND ELECTRONIC COMPONENT AND DISPLAY DEVICE EACH USING SAID CURED PRODUCT | 東レ株式会社 | 2025-04-10 | — | — | WO | disclosed |
| WO-2025005007-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT | 東レ株式会社 | 2025-01-02 | — | — | WO | disclosed |
| US-20150203631-A1 | POLYAMIC ACID RESIN COMPOSITION, POLYIMIDE FILM USING SAME, AND METHOD FOR PRODUCING SAID POLYIMIDE FILM | TORAY INDUSTRIES, INC. (JP) | 2015-07-23 | — | — | US | disclosed |
| EP-2881417-A1 | POLYAMIDE ACID RESIN COMPOSITION, POLYIMIDE FILM USING SAME, AND METHOD FOR PRODUCING SAID POLYIMIDE FILM | Toray Industries, Inc. (JP) | 2015-06-10 | — | — | EP | disclosed |
| CN-104508008-A | Polyamide acid resin composition, polyimide film using same, and method for producing said polyimide film | TORAY INDUSTRIES | 2015-04-08 | — | — | CN | disclosed |
| US-20150045502-A1 | POLYAMIDE ACID AND RESIN COMPOSITION CONTAINING SAME | TORAY INDUSTRIES, INC. (JP) | 2015-02-12 | — | — | US | disclosed |
| EP-2832769-A1 | POLYAMIDE ACID AND RESIN COMPOSITION CONTAINING SAME | Toray Industries, Inc. (JP) | 2015-02-04 | — | — | EP | disclosed |
| US-7638254-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2009-12-29 | — | — | US | disclosed |
| US-20090011364-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART | HATTORI TAKASHI | 2009-01-08 | — | — | US | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |