⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29394308 | 0.87 | — | — | |
| SCHEMBL29353941 | 0.87 | — | — | |
| SCHEMBL30515424 | 0.87 | — | — | |
| SCHEMBL31020876 | 0.87 | — | — | |
| SCHEMBL31365278 | 0.75 | — | — | |
| SCHEMBL4385132 | 0.75 | — | — | |
| SCHEMBL11684099 | 0.75 | — | — | |
| SCHEMBL34463636 | 0.75 | — | — | |
| SCHEMBL31738501 | 0.75 | — | — | |
| SCHEMBL31746085 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118023761-A | Alloy solder and preparation method thereof | 江苏长灵贵金属有限公司 | 2024-05-14 | — | — | CN | disclosed |
| CN-117773407-B | High-ductility tin-silver-copper-nickel solder and preparation method thereof | 江苏银和金属材料有限公司 | 2024-05-07 | — | — | CN | disclosed |
| CN-117773407-A | High-ductility tin-silver-copper-nickel solder and preparation method thereof | 江苏银和金属材料有限公司 | 2024-03-29 | — | — | CN | disclosed |
| CN-109396687-B | Lead-free solder composition | 现代自动车株式会社 | 2022-05-24 | — | — | CN | disclosed |