Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.37 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.36 |
| ▸ | ACHE | P22303 | 5/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | PABPC1 | P11940 | 1/20 | 0.33 |
| ▸ | EIF4H | Q15056 | 1/20 | 0.33 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28674067 | 1.00 | HDAC8 (0.41) | HDAC8KDM4EHDAC1HDAC4ACHE | |
| SCHEMBL29558431 | 0.95 | KDM4E (0.41) | HDAC8KDM4EHDAC1HDAC4ACHE | |
| SCHEMBL28687693 | 0.95 | KDM4E (0.41) | HDAC8KDM4EHDAC1HDAC4ACHE | |
| SCHEMBL21523390 | 0.85 | PABPC1 (0.49) | HDAC8KDM4EHDAC1HDAC4PABPC1 | |
| SCHEMBL1560475 | 0.84 | TDP1 (0.43) | HDAC8ACHETDP1PABPC1EIF4H | |
| Water SCHEMBL1913462 | 0.83 | TDP1 (0.42) | HDAC8ACHETDP1PABPC1EIF4H | |
| SCHEMBL21523398 | 0.81 | PABPC1 (0.44) | HDAC8KDM4EHDAC1HDAC4ACHE | |
| SCHEMBL1560454 | 0.80 | TDP1 (0.42) | HDAC8KDM4EACHETDP1PABPC1 | |
| Water SCHEMBL8976375 | 0.78 | TDP1 (0.41) | HDAC8KDM4EACHETDP1PABPC1 | |
| SCHEMBL9172343 | 0.76 | PABPC1 (0.45) | KDM4EPABPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114262917-A | Electrolytic nickel (alloy) plating solution | 日本高纯度化学株式会社 | 2022-04-01 | — | — | CN | claimed |
| CN-114262917-A | Electrolytic nickel (alloy) plating solution | 日本高纯度化学株式会社 | 2022-04-01 | — | — | CN | disclosed |