Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 4/20 | 0.64 |
| ▸ | MAPT | P10636 | 2/20 | 0.64 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.64 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.52 |
| ▸ | TSHR | P16473 | 2/20 | 0.52 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.52 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.52 |
| ▸ | BLM | P54132 | 1/20 | 0.52 |
| ▸ | AGER | Q15109 | 1/20 | 0.52 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.52 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.52 |
| ▸ | PAX8 | Q06710 | 1/20 | 0.47 |
| ▸ | ASPH | Q12797 | 2/20 | 0.45 |
| ▸ | KDM8 | Q8N371 | 2/20 | 0.45 |
| ▸ | MET | P08581 | 1/20 | 0.45 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.44 |
| ▸ | NPC1 | O15118 | 1/20 | 0.43 |
| ▸ | RAB9A | P51151 | 1/20 | 0.43 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.43 |
| ▸ | GAA | P10253 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL8126278 | 0.98 | KDM4E (0.62) | KDM4EMAPTCYP1A2ALDH1A1TSHR | |
| SCHEMBL27435770 | 0.90 | KDM4E (0.60) | KDM4EMAPTCYP1A2ALDH1A1TSHR | |
| SCHEMBL163384 | 0.89 | KDM4E (0.50) | KDM4EMAPTCYP1A2ALDH1A1TSHR | |
| SCHEMBL27231741 | 0.89 | KDM4E (0.72) | KDM4EMAPTCYP1A2ALDH1A1TSHR | |
| SCHEMBL27410791 | 0.87 | KDM4E (0.57) | KDM4EMAPTCYP1A2ALDH1A1TSHR | |
| SCHEMBL30006999 | 0.86 | KDM4E (0.47) | KDM4EMAPTCYP1A2ALDH1A1TSHR | |
| SCHEMBL28492022 | 0.86 | KDM4E (0.47) | KDM4EMAPTCYP1A2ALDH1A1TSHR | |
| SCHEMBL1551666 | 0.85 | KDM4E (0.46) | KDM4EMAPTCYP1A2ALDH1A1TSHR | |
| SCHEMBL10749832 | 0.84 | KDM4E (0.62) | KDM4EMAPTCYP1A2ALDH1A1TSHR | |
| SCHEMBL27435766 | 0.83 | KDM4E (0.60) | KDM4EMAPTCYP1A2ALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101624714-B | Cu-Sn-Zn plating solution containing organic addition agent and electroplating technique utilizing same | QIANG DU | 2010-12-29 | — | — | CN | claimed |
| CN-101624714-A | Cu-Sn-Zn plating solution containing organic addition agent and electroplating technique utilizing same | QIANG DU | 2010-01-13 | — | — | CN | claimed |
| EP-0377357-B1 | Process for the condensation of at least one epoxide on at least one cyclic anhyhride in the presence of a titanium-based catalyst | INST FRANCAIS DU PETROLE (FR) | 1994-03-23 | — | — | EP | claimed |
| US-4997910-A | Polyesters | INSTITUT FRANCAIS DU PETROLE (FR) | 1991-03-05 | — | — | US | claimed |
| EP-0193848-B1 | GALVANIC BATH FOR THE ELECTRODEPOSITION OF GOLD ALLOYS | Emmenegger, Heinz (CH) | 1989-08-16 | — | — | EP | claimed |
| US-4687557-A | MIXTURE OF CYANIDE COMPLEXES OF GOLD, COPPER, CADMIUM, AND ZINC | EMMENEGGER HEINZ (CH) | 1987-08-18 | — | — | US | claimed |
| EP-0143919-B1 | ALKALINE CYANIDE BATH FOR THE ELECTRODEPOSITION OF COPPER-TIN-ALLOY LAYERS | Degussa Aktiengesellschaft (DE) | 1987-07-29 | — | — | EP | claimed |
| EP-0193848-A1 | Galvanic bath for the electrodeposition of gold alloys | Emmenegger, Heinz (CH) | 1986-09-10 | — | — | EP | claimed |
| US-4565608-A | Alkaline cyanide bath for electrolytic deposition of copper-tin-alloy coatings | DEGUSSA AKTIENGESELLSCHAFT (DE) | 1986-01-21 | — | — | US | claimed |
| EP-0143919-A1 | Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers | Degussa Aktiengesellschaft (DE) | 1985-06-12 | — | — | EP | claimed |
| CN-110291229-B | Aqueous alkaline electrolyte for depositing a zinc-containing layer on the surface of a metal blank | 科德宝两合公司 | 2022-04-29 | — | — | CN | disclosed |
| CN-110846693-B | High-dispersity alkaline cyanide-free zinc plating brightener and preparation method and application thereof | 武汉奥邦表面技术有限公司 | 2020-11-10 | — | — | CN | disclosed |
| CN-110846693-A | High-dispersity alkaline cyanide-free zinc plating brightener and preparation method and application thereof | 武汉奥邦表面技术有限公司 | 2020-02-28 | — | — | CN | disclosed |
| CN-104195593-A | An additive for zinc electrodeposition in an ammoniacal system and a preparing method thereof | WANG RUIXIANG | 2014-12-10 | — | — | CN | disclosed |
| CN-101624714-B | Cu-Sn-Zn plating solution containing organic addition agent and electroplating technique utilizing same | QIANG DU | 2010-12-29 | — | — | CN | disclosed |
| EP-0143919-B1 | ALKALINE CYANIDE BATH FOR THE ELECTRODEPOSITION OF COPPER-TIN-ALLOY LAYERS | Degussa Aktiengesellschaft (DE) | 1987-07-29 | — | — | EP | disclosed |
| EP-0193848-A1 | Galvanic bath for the electrodeposition of gold alloys | Emmenegger, Heinz (CH) | 1986-09-10 | — | — | EP | disclosed |
| US-4605474-A | Alkaline cyanide bath for electrolytic deposition of copper-tin-alloy coatings | HOFFACKER GERD (DE) | 1986-08-12 | — | — | US | disclosed |
| US-4565608-A | Alkaline cyanide bath for electrolytic deposition of copper-tin-alloy coatings | DEGUSSA AKTIENGESELLSCHAFT (DE) | 1986-01-21 | — | — | US | disclosed |
| EP-0143919-A1 | Alkaline cyanide bath for the electrodeposition of copper-tin-alloy layers | Degussa Aktiengesellschaft (DE) | 1985-06-12 | — | — | EP | disclosed |