SCHEMBL29610362

SCHEMBL29610362

Oc1ccccc1Cc1c(O)cccc1-c1ccccc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSPA5 P11021 1/20 0.54
ALDH1A1 P00352 1/20 0.52
HPGD P15428 1/20 0.52
BCL2L1 Q07817 1/20 0.52
HSD17B10 Q99714 1/20 0.52
PDCD1 Q15116 1/20 0.46
CD274 Q9NZQ7 1/20 0.46
CYP1A2 P05177 1/20 0.46
KEAP1 Q14145 1/20 0.44
BACE1 P56817 1/20 0.43
FOLH1 Q04609 1/20 0.42
DPP4 P27487 1/20 0.42
AKR1B1 P15121 1/20 0.42
KMT2A Q03164 1/20 0.41
CYP2D6 P10635 1/20 0.39
TSHR P16473 1/20 0.39
HIF1A Q16665 1/20 0.39
ALOX5 P09917 1/20 0.38
TAAR1 Q96RJ0 1/20 0.38
HNF4A P41235 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11206474 0.88 HSD17B10 (0.60) HSPA5ALDH1A1HPGDBCL2L1HSD17B10
SCHEMBL30957367 0.84 ALDH1A1 (0.50) HSPA5ALDH1A1HPGDBCL2L1HSD17B10
SCHEMBL9307995 0.83 BCL2L1 (0.54) ALDH1A1HPGDBCL2L1HSD17B10CYP1A2
SCHEMBL9307991 0.82 HSPA5 (0.67) HSPA5ALDH1A1HPGDBCL2L1HSD17B10
SCHEMBL28177209 0.81 HSPA5 (0.59) HSPA5ALDH1A1HPGDBCL2L1HSD17B10
SCHEMBL28221492 0.80 ALDH1A1 (0.60) ALDH1A1HPGDBCL2L1HSD17B10PDCD1
SCHEMBL8518214 0.79 HSPA5 (0.50) HSPA5ALDH1A1HPGDHSD17B10CYP1A2
SCHEMBL4063843 0.78 HSPA5 (0.73) HSPA5HSD17B10CYP1A2KEAP1AKR1B1
SCHEMBL2683682 0.77 ALDH1A1 (0.56) ALDH1A1HPGDBCL2L1HSD17B10PDCD1
SCHEMBL15911092 0.77 ALDH1A1 (0.56) ALDH1A1HPGDBCL2L1HSD17B10PDCD1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109971376-B Dicing die bonding film 日东电工株式会社 2022-05-10 CN disclosed