Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 2/20 | 0.36 |
| ▸ | FAAH | O00519 | 4/20 | 0.33 |
| ▸ | CNR1 | P21554 | 1/20 | 0.33 |
| ▸ | CNR2 | P34972 | 1/20 | 0.33 |
| ▸ | HDAC3 | O15379 | 2/20 | 0.31 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.31 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.31 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.31 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.31 |
| ▸ | CES2 | O00748 | 1/20 | 0.31 |
| ▸ | CES1 | P23141 | 1/20 | 0.31 |
| ▸ | CTSD | P07339 | 1/20 | 0.30 |
| ▸ | FFAR3 | O14843 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31434634 | 1.00 | ALDH1A1 (0.37) | ALDH1A1LMNAFAAHCNR1CNR2 | |
| SCHEMBL2475707 | 0.98 | ALDH1A1 (0.38) | ALDH1A1LMNAFAAHCNR1CNR2 | |
| SCHEMBL30462935 | 0.96 | ALDH1A1 (0.37) | ALDH1A1LMNAFAAHCNR1CNR2 | |
| SCHEMBL124651 | 0.96 | ALDH1A1 (0.37) | ALDH1A1LMNAFAAHCNR1CNR2 | |
| SCHEMBL8755214 | 0.91 | FFAR3 (0.35) | ALDH1A1LMNAFAAHCNR1CNR2 | |
| SCHEMBL15901822 | 0.88 | FFAR3 (0.36) | ALDH1A1LMNAHDAC3HDAC1HDAC2 | |
| SCHEMBL4134314 | 0.88 | FFAR3 (0.36) | ALDH1A1LMNAHDAC3HDAC1HDAC2 | |
| SCHEMBL483263 | 0.88 | FFAR3 (0.36) | ALDH1A1LMNAHDAC3HDAC1HDAC2 | |
| SCHEMBL7509947 | 0.88 | FFAR3 (0.36) | ALDH1A1LMNAHDAC3HDAC1HDAC2 | |
| SCHEMBL25284141 | 0.85 | ALDH1A1 (0.34) | ALDH1A1LMNAFAAHCNR1CNR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-121586750-A | Composition for forming silicon-containing underlayer film for directional self-assembly | 日产化学株式会社 | 2026-02-27 | — | — | CN | disclosed |
| CN-113785243-B | Composition for resist pattern metallization process | 日产化学株式会社 | 2025-05-02 | — | — | CN | disclosed |
| CN-119768742-A | Composition for forming silicon-containing resist underlayer film | 日产化学株式会社 | 2025-04-04 | — | — | CN | disclosed |
| CN-119563142-A | Composition for forming silicon-containing resist underlayer film containing multifunctional sulfonic acid | 日产化学株式会社 | 2025-03-04 | — | — | CN | disclosed |
| CN-119463802-A | Room temperature vulcanized silicone sealant for yellowing-resistant bulb lamp and preparation method thereof | 宁波聚力新材料科技有限公司 | 2025-02-18 | — | — | CN | disclosed |
| CN-119487453-A | Method for manufacturing laminate and method for manufacturing semiconductor element | 日产化学株式会社 | 2025-02-18 | — | — | CN | disclosed |
| US-20240419073-A1 | ADDITIVE-CONTAINING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2024-12-19 | — | — | US | disclosed |
| CN-118382676-A | Low temperature fast cure dual cure silicone | 美国陶氏有机硅公司 | 2024-07-23 | — | — | CN | disclosed |
| CN-115362216-B | Composition for forming film | 日产化学株式会社 | 2024-07-19 | — | — | CN | disclosed |
| CN-114761492-B | Highly thermally conductive flowable silicone composition | 美国陶氏有机硅公司 | 2024-06-11 | — | — | CN | disclosed |
| EP-4069781-A1 | HIGHLY THERMALLY CONDUCTIVE FLOWABLE SILICONE COMPOSITION | Dow Silicones Corporation (US) | 2022-10-12 | — | — | EP | disclosed |
| WO-2022210954-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION | 日産化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210901-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210262-A1 | LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE | 日産化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210944-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION | 日産化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210960-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION | 日産化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| CN-114981336-A | Dual cure composition | 美国陶氏有机硅公司 | 2022-08-30 | — | — | CN | disclosed |
| CN-114761492-A | Highly thermally conductive flowable silicone composition | 美国陶氏有机硅公司 | 2022-07-15 | — | — | CN | disclosed |
| CN-114466883-A | Organopolysiloxane cluster polymers for rapid air cure | 美国陶氏有机硅公司 | 2022-05-10 | — | — | CN | disclosed |
| CN-114302917-A | Dual cure composition | 美国陶氏有机硅公司 | 2022-04-08 | — | — | CN | disclosed |