Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 6/20 | 0.64 |
| ▸ | FAAH | O00519 | 5/20 | 0.58 |
| ▸ | CASP2 | P42575 | 1/20 | 0.55 |
| ▸ | DNM1 | Q05193 | 2/20 | 0.54 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.53 |
| ▸ | MEN1 | O00255 | 1/20 | 0.53 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.53 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.53 |
| ▸ | NAAA | Q02083 | 1/20 | 0.52 |
| ▸ | EPHX2 | P34913 | 4/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11252841 | 0.96 | EPHX1 (0.67) | EPHX1FAAHCASP2DNM1HSP90AA1 | |
| SCHEMBL11257359 | 0.96 | EPHX1 (0.67) | EPHX1FAAHCASP2DNM1HSP90AA1 | |
| SCHEMBL8920072 | 0.90 | EPHX2 (0.66) | EPHX2 | |
| SCHEMBL8919292 | 0.90 | EPHX2 (0.66) | EPHX2 | |
| SCHEMBL8325150 | 0.87 | EPHX2 (0.62) | EPHX2 | |
| SCHEMBL9186394 | 0.85 | EPHX2 (0.51) | EPHX1MEN1KMT2AEPHX2 | |
| SCHEMBL7747976 | 0.84 | EPHX1 (0.47) | EPHX1FAAHCASP2DNM1HSP90AA1 | |
| SCHEMBL23468585 | 0.84 | FAAH (0.72) | EPHX1FAAHCASP2DNM1NAAA | |
| SCHEMBL9307240 | 0.84 | EPHX1 (0.60) | EPHX1CASP2NAAAEPHX2 | |
| SCHEMBL7693160 | 0.84 | FAAH (0.78) | EPHX1FAAHCASP2DNM1HSP90AA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111836695-B | Flux, solder paste, soldering process, method for manufacturing soldered product, and method for manufacturing BGA package | 株式会社欧利生 | 2022-06-24 | — | — | CN | disclosed |