SCHEMBL29629116

SCHEMBL29629116

CCCCCCCCCCCC[P+](CCCC)(CCCC)CCCC.CCCCS(=O)(=O)[O-]

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 2/20 0.60
EPHX2 P34913 2/20 0.40
FAAH O00519 2/20 0.39
RECQL P46063 2/20 0.38
BBOX1 O75936 2/20 0.38
TSHR P16473 2/20 0.38
MAPK1 P28482 2/20 0.38
GLA P06280 1/20 0.38
HPGD P15428 1/20 0.38
BLM P54132 1/20 0.38
CA2 P00918 3/20 0.37
ENPEP Q07075 1/20 0.36
NR1I2 O75469 1/20 0.36
GMNN O75496 1/20 0.35
ALDH1A1 P00352 1/20 0.35
LMNA P02545 1/20 0.35
TP53 P04637 1/20 0.35
THPO P40225 1/20 0.35
HBB P68871 1/20 0.35
PMP22 Q01453 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29629118 1.00 DNM1 (0.60) DNM1EPHX2FAAHRECQLBBOX1
SCHEMBL17956165 0.98 DNM1 (0.56) DNM1EPHX2FAAHRECQLBBOX1
SCHEMBL714744 0.96 DNM1 (0.60) DNM1EPHX2FAAHRECQLBBOX1
SCHEMBL18112880 0.96 DNM1 (0.60) DNM1EPHX2FAAHRECQLBBOX1
SCHEMBL4455010 0.94 DNM1 (0.56) DNM1EPHX2FAAHRECQLBBOX1
SCHEMBL715124 0.94 DNM1 (0.56) DNM1EPHX2FAAHRECQLBBOX1
SCHEMBL4452733 0.94 DNM1 (0.56) DNM1EPHX2FAAHRECQLBBOX1
SCHEMBL4466355 0.94 DNM1 (0.56) DNM1EPHX2FAAHRECQLBBOX1
SCHEMBL7560711 0.94 DNM1 (0.56) DNM1EPHX2FAAHRECQLBBOX1
SCHEMBL4463177 0.94 DNM1 (0.56) DNM1EPHX2FAAHRECQLBBOX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11769606-B2 Conductive metal paste NISSHINBO HOLDINGS INC. (JP) 2023-09-26 US disclosed
US-20220172858-A1 CONDUCTIVE METAL PASTE NISSHINBO HOLDINGS INC. (JP) 2022-06-02 US disclosed