Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 6/20 | 0.61 |
| ▸ | MAPT | P10636 | 6/20 | 0.61 |
| ▸ | MEN1 | O00255 | 4/20 | 0.61 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.61 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.61 |
| ▸ | POLB | P06746 | 3/20 | 0.61 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.61 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.61 |
| ▸ | NPSR1 | Q6W5P4 | 6/20 | 0.54 |
| ▸ | CFTR | P13569 | 1/20 | 0.49 |
| ▸ | GOPC | Q9HD26 | 1/20 | 0.49 |
| ▸ | CYP3A4 | P08684 | 6/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | GPR55 | Q9Y2T6 | 2/20 | 0.48 |
| ▸ | TP53 | P04637 | 2/20 | 0.48 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.48 |
| ▸ | ESR1 | P03372 | 1/20 | 0.48 |
| ▸ | TYMS | P04818 | 1/20 | 0.48 |
| ▸ | TSHR | P16473 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17698475 | 1.00 | LMNA (0.61) | LMNAMAPTMEN1KMT2ATDP1 | |
| Cyanate SCHEMBL31679672 | 0.96 | LMNA (0.60) | LMNAMAPTMEN1KMT2ATDP1 | |
| SCHEMBL14376175 | 0.84 | LMNA (0.67) | LMNAMAPTMEN1KMT2ATDP1 | |
| SCHEMBL10866978 | 0.80 | MAPT (0.64) | LMNAMAPTMEN1KMT2ATDP1 | |
| SCHEMBL24603036 | 0.80 | LMNA (0.76) | LMNAMAPTMEN1KMT2ATDP1 | |
| SCHEMBL29489127 | 0.79 | ESR1 (0.55) | LMNAMAPTMEN1KMT2ATDP1 | |
| SCHEMBL4262501 | 0.79 | ESR1 (0.55) | LMNAMAPTMEN1KMT2ATDP1 | |
| SCHEMBL3411995 | 0.79 | CFTR (0.61) | LMNAMAPTMEN1KMT2ATDP1 | |
| SCHEMBL29664248 | 0.79 | CFTR (0.61) | LMNAMAPTMEN1KMT2ATDP1 | |
| Cyanate SCHEMBL27085295 | 0.79 | LMNA (0.87) | LMNAMAPTMEN1KMT2ATDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4610285-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-09-03 | — | — | EP | disclosed |
| WO-2023095613-A1 | CYCLIC ORGANOSILOXANE CONTAINING IMIDE BOND AND POLYMERIZABLE UNSATURATED BOND, AND CURABLE RESIN COMPOSITION COMPRISING SAID CYCLIC ORGANOSILOXANE | 信越化学工業株式会社 | 2023-06-01 | — | — | WO | disclosed |
| US-20230106050-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-04-06 | — | — | US | disclosed |
| WO-2022264984-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| WO-2022264987-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| WO-2022264994-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| CN-115175951-A | Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-10-11 | — | — | CN | disclosed |
| WO-2022201619-A1 | THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE | 日本化薬株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022201620-A1 | RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE | 日本化薬株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022201621-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 日本化薬株式会社 | 2022-09-29 | — | — | WO | disclosed |
| CN-115003716-A | Resin composition, resin sheet, prepreg, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-09-02 | — | — | CN | disclosed |
| WO-2022124130-A1 | COPPER-CLAD LAMINATED BOARD AND PRINTED WIRING BOARD | 三菱瓦斯化学株式会社 | 2022-06-16 | — | — | WO | disclosed |
| WO-2022124129-A1 | RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAYERED BOARD, AND PRINTED WIRING BOARD | 三菱瓦斯化学株式会社 | 2022-06-16 | — | — | WO | disclosed |