SCHEMBL29697230

SCHEMBL29697230

C=CC(=O)OC1(OC(=O)C=C)COCCO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12796084 0.79
SCHEMBL30783362 0.74 ALDH1A1 (0.31)
SCHEMBL31578484 0.74 TSHR (0.32)
SCHEMBL9346745 0.71
SCHEMBL7863401 0.71 ALDH1A1 (0.35)
SCHEMBL8762253 0.70 TSHR (0.31)
SCHEMBL30283423 0.70 TSHR (0.36)
SCHEMBL12796100 0.69
SCHEMBL12796087 0.69
SCHEMBL12902855 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118894962-B Aging-resistant holographic polymer dispersed liquid crystal material, grating device and preparation method thereof 尼卡光学(天津)有限公司 2025-01-21 CN claimed
CN-118894969-B Holographic polymer dispersed liquid crystal material with thermal aging resistance, grating device and preparation method of holographic polymer dispersed liquid crystal material 尼卡光学(天津)有限公司 2025-01-03 CN claimed
CN-119119374-A UV-cured high-temperature-resistant resin for thermal runaway protection material and application 武汉长盈鑫科技有限公司 2024-12-13 CN claimed
CN-118894962-A Aging-resistant holographic polymer dispersed liquid crystal material, grating device and preparation method thereof 尼卡光学(天津)有限公司 2024-11-05 CN claimed
CN-118894969-A Holographic polymer dispersed liquid crystal material with thermal aging resistance, grating device and preparation method of holographic polymer dispersed liquid crystal material 尼卡光学(天津)有限公司 2024-11-05 CN claimed
CN-118006168-A High-shear UV flame-retardant ink for insulating and protecting battery cells and preparation method thereof 东莞市联灏新材料技术开发有限公司 2024-05-10 CN claimed
CN-113867101-B White photosensitive cover film composition for LED, cover film and preparation method thereof 杭州福斯特电子材料有限公司 2023-10-24 CN claimed
CN-113388075-B Composition for 3D printing, 3D printing method and device 珠海赛纳三维科技有限公司 2023-03-24 CN claimed
WO-2022258030-A1 COMPOSITION FOR 3D PRINTING, AND 3D PRINTING METHOD AND DEVICE 珠海赛纳三维科技有限公司 2022-12-15 WO claimed
CN-109884859-B High-flexibility and high-resolution photosensitive epoxy acrylic resin composition 杭州福斯特电子材料有限公司 2022-06-10 CN claimed
CN-120152853-A Ink jet recording apparatus and ink jet recording method 富士胶片株式会社 2025-06-13 CN disclosed
CN-120005376-A Resin composition and product thereof 台光电子材料(昆山)股份有限公司 2025-05-16 CN disclosed
CN-120005377-A Polymer, resin composition containing the same, product and preparation method thereof 台光电子材料(昆山)股份有限公司 2025-05-16 CN disclosed
US-20250154353-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) 2025-05-15 US disclosed
US-20250154313-A1 POLYMER, RESIN COMPOSITION, ARTICLE COMPRISING THE SAME, AND PREPARATION METHOD THEREOF ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) 2025-05-15 US disclosed
WO-2022258030-A1 COMPOSITION FOR 3D PRINTING, AND 3D PRINTING METHOD AND DEVICE 珠海赛纳三维科技有限公司 2022-12-15 WO disclosed
CN-112534005-B Production of decorated leather 爱克发有限公司 2022-11-11 CN disclosed
CN-112334551-B Acylphosphine oxide initiators 爱克发有限公司 2022-11-08 CN disclosed
CN-114839838-A Photosensitive resin composition 味之素株式会社 2022-08-02 CN disclosed
CN-109884859-B High-flexibility and high-resolution photosensitive epoxy acrylic resin composition 杭州福斯特电子材料有限公司 2022-06-10 CN disclosed