Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ATM | Q13315 | 1/20 | 0.46 |
| ▸ | HCAR2 | Q8TDS4 | 4/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | RAB9A | P51151 | 1/20 | 0.36 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
| ▸ | HPGD | P15428 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | GSTP1 | P09211 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 2/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | APP | P05067 | 2/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | PRKCA | P17252 | 2/20 | 0.30 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6150923 | 0.95 | ATM (0.44) | ATMHCAR2MAPTRAB9ANPSR1 | |
| SCHEMBL28214424 | 0.94 | ATM (0.41) | ATMHCAR2MAPTRAB9ANPSR1 | |
| SCHEMBL15251687 | 0.89 | ATM (0.39) | ATMHCAR2MAPTRAB9ANPSR1 | |
| SCHEMBL6657723 | 0.89 | ATM (0.43) | ATMHCAR2MAPTRAB9ANPSR1 | |
| SCHEMBL29248411 | 0.84 | ATM (0.44) | ATMHCAR2MAPTRAB9ANPSR1 | |
| SCHEMBL20137398 | 0.83 | ATM (0.41) | ATMHCAR2MAPTRAB9ANPSR1 | |
| SCHEMBL2468781 | 0.83 | ATM (0.50) | ATMHCAR2MAPTRAB9ANPSR1 | |
| SCHEMBL147607 | 0.83 | ATM (0.47) | ATMHCAR2MAPTRAB9ANPSR1 | |
| SCHEMBL7629294 | 0.83 | ATM (0.43) | ATMHCAR2MAPTRAB9ANPSR1 | |
| SCHEMBL15015541 | 0.83 | ATM (0.43) | ATMHCAR2MAPTRAB9ANPSR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 387 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119709106-A | Silicone sealant for low-water vapor transmittance photovoltaic module and preparation method thereof | 湖北兴瑞硅材料有限公司 | 2025-03-28 | — | — | CN | claimed |
| WO-2024216910-A1 | HIGH-CHEMICAL-RESISTANCE POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND USE THEREOF | 明士(北京)新材料开发有限公司 | 2024-10-24 | — | — | WO | claimed |
| CN-118126445-A | Filling plastic prepared from waste glass fiber reinforced plastic recovered product and production process thereof | 无锡市玻尔曼技术研发有限公司 | 2024-06-04 | — | — | CN | claimed |
| CN-117209673-B | Flame-retardant low-temperature toughening synergistic anti-dripping agent and preparation method thereof | 铨盛聚碳科技股份有限公司 | 2024-04-26 | — | — | CN | claimed |
| US-11883790-B2 | Hollow particles, method for producing same, and usage of same | SEKISUI KASEI CO., LTD. (JP) | 2024-01-30 | — | — | US | claimed |
| CN-117209673-A | Flame-retardant low-temperature toughening synergistic anti-dripping agent and preparation method thereof | 铨盛聚碳科技股份有限公司 | 2023-12-12 | — | — | CN | claimed |
| CN-116149140-B | Positive photosensitive resin composition with high chemical resistance and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-07-14 | — | — | CN | claimed |
| CN-116149140-A | Positive photosensitive resin composition with high chemical resistance and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-05-23 | — | — | CN | claimed |
| CN-111902206-B | Hollow particles, method for producing same, and use thereof | 积水化成品工业株式会社 | 2023-03-24 | — | — | CN | claimed |
| US-20220351876-A1 | ACRYLIC CONDUCTIVE PASTE FOR SEMICONDUCTOR DEVICE AND METHODS | SOLTRIUM ADVANCED MATERIALS TECH LTD (CN) | 2022-11-03 | — | — | US | claimed |
| EP-3162434-A1 | HOLLOW PARTICLES, METHOD FOR PRODUCING SAME, USE THEREOF, AND METHOD FOR PRODUCING MICROCAPSULE PARTICLES | Sekisui Plastics Co., Ltd. (JP) | 2017-05-03 | — | — | EP | claimed |
| US-20170114243-A1 | HOLLOW PARTICLES, METHOD FOR PRODUCING SAME, USE THEREOF, AND METHOD FOR PRODUCING MICROCAPSULE PARTICLES | SEKISUI PLASTICS CO., LTD. (JP) | 2017-04-27 | — | — | US | claimed |
| CN-106488802-A | Hollow particles, method for the production thereof, use thereof and method for producing microencapsulated particles | 积水化成品工业株式会社 | 2017-03-08 | — | — | CN | claimed |
| WO-2016038177-A1 | PROCESS FOR PRODUCING GRAFT COPOLYMERS ON POLYOLEFIN BACKBONE | BOREALIS AG (AT) | 2016-03-17 | — | — | WO | claimed |
| EP-2995631-A1 | Process for producing graft copolymers on polyolefin backbone | Borealis AG (AT) | 2016-03-16 | — | — | EP | claimed |
| CN-102102007-B | Radiation cured adhesive for indium tin oxide (ITO) circuit and module protection | DONGGUAN POLOMA NEW MATERIAL TECHNOLOGY DEV CO LTD | 2013-04-24 | — | — | CN | claimed |
| CN-102146272-A | Radiation curing sealant for packaging glasses nameplate or ornament | DONGGUAN POWERBOND NEW MATERIAL TECHNOLOGY DEV CO LTD | 2011-08-10 | — | — | CN | claimed |
| CN-102102007-A | Radiation curing adhesive for protecting ITO circuit and module | DONGGUAN POWERBOND NEW MATERIALS TECHNOLOGY DEV CO LTD | 2011-06-22 | — | — | CN | claimed |
| CN-101928370-A | Radiation curing sealant for packaging glasses nameplate and ornaments | DONGGUAN POWERBOND MATERIALS TECHNOLOGY DEV CO LTD | 2010-12-29 | — | — | CN | claimed |
| US-6004899-A | SURFACE TREATED WITH SILANE, TITANATE, AND/OR ALUMINUM COUPLING AGENT; PIGMENT; ERASIBILITY | MITSUBISHI PAPER MILLS LIMITED (JP) | 1999-12-21 | — | — | US | claimed |