SCHEMBL29790334

SCHEMBL29790334

N#Cc1ccc(C23CC4CC(C2)CC(c2ccc(C#N)cc2)(C4)C3)cc1

nearest known ligand 0.84

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
PGR P06401 13/20 0.84
ALDH1A1 P00352 3/20 0.47
GRIN2D O15399 1/20 0.46
GRIN3B O60391 1/20 0.46
GRIN1 Q05586 1/20 0.46
GRIN2A Q12879 1/20 0.46
GRIN2B Q13224 1/20 0.46
GRIN2C Q14957 1/20 0.46
GRIN3A Q8TCU5 1/20 0.46
LMNA P02545 3/20 0.44
MEN1 O00255 2/20 0.43
KMT2A Q03164 2/20 0.43
RAD52 P43351 1/20 0.43
HTT P42858 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4752577 0.89 PGR (0.68) PGRALDH1A1LMNAMEN1KMT2A
SCHEMBL19288109 0.88 PGR (0.68) PGRALDH1A1MEN1KMT2A
SCHEMBL24617439 0.82 PGR (0.64) PGRGRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL24617375 0.82 PGR (0.64) PGRGRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL24617518 0.82 PGR (0.64) PGRGRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL24617282 0.82 PGR (0.64) PGRGRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL24617303 0.82 PGR (0.64) PGRGRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL23625604 0.82 PGR (0.64) PGRGRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL24617292 0.82 PGR (0.64) PGRGRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL24617441 0.82 PGR (0.64) PGRGRIN2DGRIN3BGRIN1GRIN2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120092029-A Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board 三菱瓦斯化学株式会社 2025-06-03 CN disclosed
CN-114787120-B Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-08-09 CN disclosed
CN-118251445-A Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same 信越化学工业株式会社 2024-06-25 CN disclosed
CN-112236464-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2024-02-23 CN disclosed
CN-112204076-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2023-10-24 CN disclosed
CN-116813824-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-09-29 CN disclosed
CN-113646393-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-09-19 CN disclosed
CN-116490555-A Copper-clad laminate and printed circuit board 三菱瓦斯化学株式会社 2023-07-25 CN disclosed
CN-116490350-A Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2023-07-25 CN disclosed
CN-113348079-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-06-02 CN disclosed
CN-114787276-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2022-07-22 CN disclosed