Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9022032 | 0.93 | — | — | |
| SCHEMBL17675664 | 0.86 | — | — | |
| SCHEMBL6498117 | 0.84 | — | — | |
| SCHEMBL3435214 | 0.81 | — | — | |
| SCHEMBL17675373 | 0.78 | — | — | |
| SCHEMBL737237 | 0.77 | ALDH1A1 (0.34) | SLC18A3 | |
| SCHEMBL2005758 | 0.77 | ALDH1A1 (0.34) | SLC18A3 | |
| SCHEMBL9234746 | 0.77 | ALDH1A1 (0.31) | — | |
| SCHEMBL3059717 | 0.75 | — | — | |
| SCHEMBL28789659 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| CN-108602338-B | Mold release film | 尤尼吉可株式会社 | 2020-08-28 | — | — | CN | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| EP-2331649-B1 | METHODS AND COMPOSITIONS FOR POLISHING SILICON-CONTAINING SUBSTRATES | CABOT MICROELECTRONICS CORP (US) | 2018-06-13 | — | — | EP | disclosed |
| CN-103080256-B | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films | BASF SE | 2015-06-24 | — | — | CN | disclosed |
| US-8597540-B2 | Compositions for polishing silicon-containing substrates | CABOT MICROELECTRONICS CORPORATION (US) | 2013-12-03 | — | — | US | disclosed |
| US-20130200039-A1 | AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS | BASF SE (DE) | 2013-08-08 | — | — | US | disclosed |
| EP-2613910-A1 | PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS | BASF SE (DE) | 2013-07-17 | — | — | EP | disclosed |
| EP-2614122-A1 | AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS | BASF SE (DE) | 2013-07-17 | — | — | EP | disclosed |
| CN-103210047-A | Aqueous polishing compositions containing N-substituted diazenium dioxides and/or N'-hydroxy-diazenium oxide salts | BASF SE | 2013-07-17 | — | — | CN | disclosed |
| WO-2010014180-A2 | METHODS AND COMPOSITIONS FOR POLISHING SILICON-CONTAINING SUBSTRATES | CABOT MICROELECTRONICS CORPORATION (US) | 2010-02-04 | — | — | WO | disclosed |
| US-20090029633-A1 | METHOD OF POLISHING A SILICON-CONTAINING DIELECTRIC | CABOT MICROELECTRONICS CORPORATION (US) | 2009-01-29 | — | — | US | disclosed |
| US-7442645-B2 | Method of polishing a silicon-containing dielectric | CABOT MICROELECTRONICS CORPORATION (US) | 2008-10-28 | — | — | US | disclosed |
| US-20060196848-A1 | Readily deinkable toners | MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT | 2006-09-07 | — | — | US | disclosed |
| US-20060144824-A1 | Method of polishing a silicon-containing dielectric | CABOT MICROELECTRONICS CORPORATION (US) | 2006-07-06 | — | — | US | disclosed |
| US-7071105-B2 | Method of polishing a silicon-containing dielectric | CABOT MICROELECTRONICS CORPORATION (US) | 2006-07-04 | — | — | US | disclosed |
| CN-1742066-A | Method of polishing a silicon-containing dielectric | CABOT MICROELECTRONICS CORP (US) | 2006-03-01 | — | — | CN | disclosed |
| EP-1601735-A1 | METHOD OF POLISHING A SILICON-CONTAINING DIELECTRIC | Cabot Microelectronics Corporation (US) | 2005-12-07 | — | — | EP | disclosed |
| WO-2004069947-A1 | METHOD OF POLISHING A SILICON-CONTAINING DIELECTRIC | CABOT MICROELECTRONICS CORPORATION (US) | 2004-08-19 | — | — | WO | disclosed |
| US-20040152309-A1 | Method of polishing a silicon-containing dielectric | CABOT MICROELECTRONICS CORPORATION | 2004-08-05 | — | — | US | disclosed |