SCHEMBL29813232

SCHEMBL29813232

Nc1cccc(-c2nnc(-c3cccc(N)c3)o2)c1

nearest known ligand 0.89

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MECP2 P51608 1/20 0.89
ATAD2 Q6PL18 1/20 0.70
NPC1 O15118 13/20 0.61
RAB9A P51151 12/20 0.61
SMN1; SMN2 Q16637 7/20 0.61
ALDH1A1 P00352 5/20 0.61
HPGD P15428 4/20 0.61
TP53 P04637 3/20 0.61
HSD17B10 Q99714 2/20 0.61
POLB P06746 1/20 0.61
KMT2A Q03164 3/20 0.59
MEN1 O00255 2/20 0.59
KDM4E B2RXH2 4/20 0.57
MAPT P10636 3/20 0.57
GLA P06280 1/20 0.57
ALOX15 P16050 1/20 0.57
TSHR P16473 3/20 0.53
NFKB1 P19838 2/20 0.53
NFKB2 Q00653 2/20 0.53
RELA Q04206 2/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3422962 1.00 MECP2 (0.89) MECP2ATAD2NPC1RAB9ASMN1; SMN2
SCHEMBL653811 0.94 MECP2 (1.00) MECP2ATAD2NPC1RAB9ASMN1; SMN2
SCHEMBL1142913 0.92 MECP2 (0.83) MECP2ATAD2NPC1RAB9ASMN1; SMN2
SCHEMBL11508555 0.92 MECP2 (0.83) MECP2ATAD2NPC1RAB9ASMN1; SMN2
SCHEMBL653790 0.89 NPC1 (0.72) MECP2ATAD2NPC1RAB9ASMN1; SMN2
SCHEMBL3910760 0.87 MECP2 (0.69) MECP2ATAD2NPC1RAB9ASMN1; SMN2
SCHEMBL2835027 0.87 MECP2 (0.69) MECP2ATAD2NPC1RAB9ASMN1; SMN2
SCHEMBL2214351 0.87 MECP2 (0.69) MECP2ATAD2NPC1RAB9ASMN1; SMN2
SCHEMBL29454527 0.86 MECP2 (0.68) MECP2ATAD2NPC1RAB9ASMN1; SMN2
SCHEMBL1543902 0.85 MECP2 (0.67) MECP2ATAD2NPC1RAB9ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113784999-B Fluorine-containing epoxy resin for electrical material and method for producing same 大金工业株式会社 2024-09-20 CN disclosed
CN-114829496-A Composition, curable composition, and cured product 大金工业株式会社 2022-07-29 CN disclosed