SCHEMBL29894074

SCHEMBL29894074

CCCCC(CC)CCC(=O)CC(=O)[O-].CCCCC(CC)CCC(=O)CC(=O)[O-].[Al+2]

nearest known ligand 0.71

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
CA2 P00918 6/20 0.71
TSHR P16473 3/20 0.44
CYP3A4 P08684 2/20 0.44
TDP1 Q9NUW8 2/20 0.44
ATM Q13315 1/20 0.44
ALDH1A1 P00352 3/20 0.42
CA1 P00915 3/20 0.39
NFKB1 P19838 1/20 0.39
MMP9 P14780 1/20 0.38
MMP8 P22894 1/20 0.38
MMP14 P50281 1/20 0.38
GPR84 Q9NQS5 1/20 0.38
HAO1 Q9UJM8 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetoacetic Acid SCHEMBL31544324 0.91 CA2 (0.63) CA2TSHRCYP3A4TDP1ATM
SCHEMBL14125872 0.83 CA2 (0.70) CA2TSHRCYP3A4TDP1ATM
SCHEMBL2703153 0.82 CA2 (0.59) CA2TSHRCYP3A4TDP1ATM
SCHEMBL8834150 0.82 CA2 (0.59) CA2TSHRCYP3A4TDP1ATM
SCHEMBL2947785 0.81 CA2 (0.58) CA2TSHRCYP3A4TDP1ATM
SCHEMBL2671793 0.80 CA2 (0.53) CA2TSHRCYP3A4TDP1ATM
SCHEMBL10380004 0.80 CA2 (0.66) CA2TSHRCYP3A4TDP1ATM
SCHEMBL10892809 0.78 CA2 (0.63) CA2TSHRCYP3A4TDP1ATM
SCHEMBL14125668 0.78 CA2 (0.63) CA2TSHRCYP3A4TDP1ATM
SCHEMBL1360064 0.77 CA2 (0.50) CA2TSHRCYP3A4TDP1ATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024117215-A1 PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE SHEET, LAMINATED MEMBER, AND DISPLAY リンテック株式会社 2024-06-06 WO disclosed
EP-4317347-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE TAPE Teraoka Seisakusho Co., Ltd. (JP) 2024-02-07 EP disclosed
US-11753547-B2 Near-infrared absorbing composition, near-infrared absorbing film, and image sensor for solid-state imaging element Konica Minolta, Inc. (JP) 2023-09-12 US disclosed
EP-2998287-B1 ALUMINIUM CHELATE COMPOUND, AND ROOM-TEMPERATURE-CURABLE RESIN COMPOSITION INCLUDING SAME SHINETSU CHEMICAL CO (JP) 2023-07-19 EP disclosed
US-11646439-B2 Battery and method of manufacturing battery LINTEC CORPORATION (JP) 2023-05-09 US disclosed
WO-2023053560-A1 INSULATIVE ADHESIVE TAPE 東洋インキSCホールディングス株式会社 2023-04-06 WO disclosed
WO-2022208815-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE TAPE 株式会社寺岡製作所 2022-10-06 WO disclosed
WO-2022208643-A1 METHOD FOR PRODUCING CLEANING LABELS AND CLEANING TAGS リンテック株式会社 2022-10-06 WO disclosed