SCHEMBL29924669

SCHEMBL29924669

CCCOC(=S)C(C)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29924494 0.84 CA12 (0.54)
SCHEMBL11413202 0.82 CA12 (0.53)
SCHEMBL29924450 0.82 CA12 (0.53)
SCHEMBL29456838 0.80
SCHEMBL27697019 0.79 ALDH1A1 (0.45)
SCHEMBL27585665 0.79
SCHEMBL28248122 0.78
SCHEMBL2963077 0.78
SCHEMBL29832137 0.72
SCHEMBL27458 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12577373-B2 Carbodiimide composition, curing agent composition, coating composition and resin cured product ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-03-17 US disclosed
US-20230135772-A1 CARBODIIMIDE COMPOSITION, CURING AGENT COMPOSITION, COATING COMPOSITION AND RESIN CURED PRODUCT ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-05-04 US disclosed
EP-4130154-A1 CARBODIIMIDE COMPOSITION, HARDENER COMPOSITION, COATING COMPOSITION, AND CURED RESIN OBJECT Asahi Kasei Kabushiki Kaisha (JP) 2023-02-08 EP disclosed
CN-115190901-A Carbodiimide composition, curing agent composition, coating composition, and resin cured product 旭化成株式会社 2022-10-14 CN disclosed