SCHEMBL29925513

SCHEMBL29925513

CCCCc1c(O)ccc(-c2ccccc2)c1CCCC

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 4/20 0.43
KDM4E B2RXH2 3/20 0.43
ALDH1A1 P00352 3/20 0.43
CASP1 P29466 2/20 0.43
CASP7 P55210 2/20 0.43
MEN1 O00255 1/20 0.43
KMT2A Q03164 1/20 0.43
GCGR P47871 2/20 0.42
NPC1 O15118 1/20 0.42
MAPK1 P28482 1/20 0.42
HTT P42858 1/20 0.42
RAB9A P51151 1/20 0.42
NPSR1 Q6W5P4 1/20 0.42
PSMB5 P28074 1/20 0.41
BACE1 P56817 2/20 0.41
ESR2 Q92731 1/20 0.41
HSD11B1 P28845 1/20 0.41
ALOX5 P09917 1/20 0.40
HSD17B10 Q99714 2/20 0.39
BCL2L1 Q07817 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29000465 1.00 HPGD (0.43) HPGDKDM4EALDH1A1CASP1CASP7
SCHEMBL324414 0.98 HPGD (0.43) HPGDKDM4EALDH1A1CASP1CASP7
SCHEMBL10610552 0.88 GCGR (0.41) HPGDKDM4EALDH1A1GCGRNPC1
SCHEMBL3215348 0.88 TYR (0.42) HPGDKDM4EALDH1A1CASP1CASP7
SCHEMBL2865287 0.88 GCGR (0.44) HPGDKDM4EALDH1A1CASP1CASP7
SCHEMBL2654884 0.88 PDCD1 (0.42) HPGDKDM4EALDH1A1CASP1CASP7
SCHEMBL2203886 0.87 GCGR (0.47) HPGDKDM4EALDH1A1CASP1CASP7
SCHEMBL1837688 0.86 BCL2L1 (0.48) HPGDALDH1A1GCGRNPC1MAPK1
SCHEMBL28638714 0.86 MAPK1 (0.43) HPGDKDM4EALDH1A1NPC1MAPK1
SCHEMBL29485643 0.86 MAPK1 (0.43) HPGDKDM4EALDH1A1NPC1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115190894-A Curable resin, curable resin composition, cured product, electronic device, laminate material, electronic component sealing material, and method for producing curable resin 中央硝子株式会社 2022-10-14 CN disclosed