SCHEMBL29975539

SCHEMBL29975539

C=COCCCCOC(=O)c1cccc(C(=O)O)c1

nearest known ligand 0.56

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.56
HTT P42858 1/20 0.42
LMNA P02545 1/20 0.41
HDAC6 Q9UBN7 1/20 0.40
KMT2A Q03164 1/20 0.40
CNR2 P34972 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2192154 1.00 TDP1 (0.56) TDP1HTTLMNAHDAC6KMT2A
SCHEMBL218011 0.95 TDP1 (0.56) TDP1LMNAHDAC6
SCHEMBL12879054 0.94 TDP1 (0.54) TDP1LMNAHDAC6KMT2A
SCHEMBL15865073 0.92 TDP1 (0.51) TDP1LMNAHDAC6KMT2A
Vinyl Ether SCHEMBL9713768 0.91 TDP1 (0.51) TDP1LMNAHDAC6
SCHEMBL216569 0.88 TDP1 (0.73) TDP1LMNAKMT2ACNR2
SCHEMBL209607 0.87 TDP1 (0.71) TDP1LMNAHDAC6KMT2A
SCHEMBL16684723 0.86 TDP1 (0.56) TDP1HTTLMNA
SCHEMBL4624467 0.86 SERPINE1 (0.47) TDP1LMNAKMT2A
SCHEMBL9436550 0.86 TDP1 (0.69) TDP1LMNAHDAC6KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025041813-A1 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ASSEMBLY 日産化学株式会社 2025-02-27 WO disclosed
US-20240302744-A1 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION NISSAN CHEMICAL CORPORATION (JP) 2024-09-12 US disclosed
US-11961636-B2 Silica-containing insulating composition NISSAN CHEMICAL CORPORATION (JP) 2024-04-16 US disclosed
WO-2024024501-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2024-02-01 WO disclosed
EP-3680918-B1 SILICA-CONTAINING INSULATING COMPOSITION NISSAN CHEMICAL CORP (JP) 2023-12-27 EP disclosed
US-11674053-B2 Composition for forming underlayer film of self-assembled film including aliphatic polycyclic structure NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2023-06-13 US disclosed
WO-2022210960-A1 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION 日産化学株式会社 2022-10-06 WO disclosed