SCHEMBL29998681

SCHEMBL29998681

CCCCCCCCCCCCOc1ccc(C(=O)c2ccccc2)c(C(=O)O)c1

nearest known ligand 0.67

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
▸ PTPN11 Q06124 5/20 0.67
▸ PLA2G4B P0C869 2/20 0.58
▸ TP53 P04637 1/20 0.57
▸ TSHR P16473 1/20 0.57
▸ PLK1 P53350 1/20 0.55
▸ PLA2G2A P14555 1/20 0.54
▸ RARB P10826 3/20 0.53
▸ KMT2A Q03164 1/20 0.52
▸ SMPD1 P17405 2/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29091229 1.00 PTPN11 (0.67) PTPN11PLA2G4BTP53TSHRPLK1
SCHEMBL30903552 0.88 PTPN11 (0.57) PTPN11PLA2G4BTP53TSHRSMPD1
SCHEMBL30903553 0.88 PTPN11 (0.57) PTPN11PLA2G4BTP53TSHRSMPD1
SCHEMBL1964738 0.88 PTPN11 (0.57) PTPN11PLA2G4BTP53TSHRSMPD1
SCHEMBL8179881 0.87 PTPN11 (0.70) PTPN11PLA2G4BTP53TSHRPLK1
SCHEMBL16836638 0.87 PTPN11 (0.70) PTPN11PLA2G4BTP53TSHRPLK1
SCHEMBL7272804 0.87 PTPN11 (0.70) PTPN11PLA2G4BTP53TSHRPLK1
Xanthene SCHEMBL26135632 0.87 PTPN11 (0.53) PTPN11PLA2G4BTP53TSHRPLK1
SCHEMBL11679030 0.87 HPGD (0.64) PTPN11PLA2G4BTP53TSHRPLK1
Octabenzone SCHEMBL27387 0.87 HPGD (0.64) PTPN11PLA2G4BTP53TSHRPLK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4668417-A1 HEAT ABSORBING BODY AND SECONDARY BATTERY MODULE COMPRISING SAID HEAT ABSORBING BODY DIC Corporation (JP) 2025-12-24 — — EP disclosed
US-20250357569-A1 HEAT ABSORBER AND SECONDARY BATTERY MODULE INCLUDING HEAT ABSORBER DIC CORPORATION (JP) 2025-11-20 — — US disclosed
US-20250043053-A1 ACTIVE ENERGY RAY-CURABLE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, AND ARTICLE DIC CORPORATION (JP) 2025-02-06 — — US disclosed
EP-4082688-A1 THREE-DIMENSIONAL MODELING PATTERN MATERIAL, CURED PRODUCT, CUBIC MOLDED ARTICLE, AND METHOD FOR PRODUCING MOLD BY USING SAID CUBIC MOLDED ARTICLE DIC Corporation (JP) 2022-11-02 — — EP disclosed
US-20220325023-A1 THREE-DIMENSIONAL MODELING PATTERN MATERIAL, CURED PRODUCT, CUBIC MOLDED ARTICLE, AND METHOD FOR PRODUCING MOLD BY USING SAID CUBIC MOLDED ARTICLE DIC CORPORATION (JP) 2022-10-13 — — US disclosed
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