SCHEMBL30018697

SCHEMBL30018697

CCCS(=O)(=O)O/N=C1\SC=C\C1=C(\C#N)c1ccccc1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1920469 1.00
SCHEMBL1920470 1.00
SCHEMBL20343908 1.00
SCHEMBL13900655 1.00
SCHEMBL18121276 1.00
SCHEMBL4363502 1.00
SCHEMBL14882988 1.00
SCHEMBL16434663 0.94 TBXA2R (0.30)
SCHEMBL17833891 0.93 BRAF (0.30)
SCHEMBL18125574 0.93 BRAF (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025132182-A2 POST-EXPOSURE BAKE LESS CHEMICALLY AMPLIFIED PHOTORESIST COMPOSITION MERCK PATENT GMBH (DE) 2025-06-26 WO disclosed
US-20220376180-A1 DEVICE CONTAINING METAL OXIDE-CONTAINING LAYERS EVONIK OPERATIONS GMBH (DE) 2022-11-24 US disclosed