⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1920469 | 1.00 | — | — | |
| SCHEMBL30018697 | 1.00 | — | — | |
| SCHEMBL1920470 | 1.00 | — | — | |
| SCHEMBL20343908 | 1.00 | — | — | |
| SCHEMBL13900655 | 1.00 | — | — | |
| SCHEMBL18121276 | 1.00 | — | — | |
| SCHEMBL14882988 | 1.00 | — | — | |
| SCHEMBL16434663 | 0.94 | TBXA2R (0.30) | — | |
| SCHEMBL17833891 | 0.93 | BRAF (0.30) | — | |
| SCHEMBL18125574 | 0.93 | BRAF (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2980058-B1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-03 | — | — | EP | disclosed |
| US-20220326614-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND PARTITION WALL OF ORGANIC EL ELEMENT | SHOWA DENKO K.K. (JP) | 2022-10-13 | — | — | US | disclosed |
| US-10962880-B2 | Radiation-sensitive compositions and patterning and metallization processes | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2021-03-30 | — | — | US | disclosed |
| US-20200201175-A1 | RADIATION-SENSITIVE COMPOSITIONS AND PATTERNING AND METALLIZATION PROCESSES | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2020-06-25 | — | — | US | disclosed |
| US-10551745-B2 | Photopatternable compositions and methods of fabricating transistor devices using same | FLEXTERRA, INC. (US) | 2020-02-04 | — | — | US | disclosed |
| EP-3406640-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR BIOCHIP AND METHOD FOR FORMING LIQUID-REPELLENT FILM | AGC INC. (JP) | 2018-11-28 | — | — | EP | disclosed |
| US-20180307140-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR BIOCHIP AND METHOD FOR FORMING LIQUID REPELLENT FILM | ASAHI GLASS COMPANY, LIMITED (JP) | 2018-10-25 | — | — | US | disclosed |
| EP-3376286-A1 | PHOTOSENSITIVE COMPOSITION FOR BIOCHIP FOR FLUORESCENCE ANALYSIS, METHOD FOR MANUFACTURING BIOCHIP FOR FLUORESCENCE ANALYSIS, AND BIOCHIP FOR FLUORESCENCE ANALYSIS | Asahi Glass Company, Limited (JP) | 2018-09-19 | — | — | EP | disclosed |
| US-20180202934-A1 | PHOTOSENSITIVE COMPOSITION FOR BIOCHIP FOR FLUORESCENCE ANALYSIS, METHOD FOR PRODUCING BIOCHIP FOR FLUORESCENCE ANALYSIS, AND BIOCHIP FOR FLUORESCENCE ANALYSIS | ASAHI GLASS COMPANY, LIMITED (JP) | 2018-07-19 | — | — | US | disclosed |
| US-20180188648-A1 | RADIATION-SENSITIVE COMPOSITIONS AND PATTERNING AND METALLIZATION PROCESSES | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2018-07-05 | — | — | US | disclosed |
| US-20160046552-A1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2016-02-18 | — | — | US | disclosed |
| EP-2980058-A1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2016-02-03 | — | — | EP | disclosed |
| US-9244346-B2 | Negative-type photosensitive resin composition, pattern forming method, cured film, insulating film, color filter, and display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2016-01-26 | — | — | US | disclosed |
| US-9029270-B2 | Phenolic resin composition, and methods for manufacturing cured relief pattern and semiconductor | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2015-05-12 | — | — | US | disclosed |
| US-20140349222-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2014-11-27 | — | — | US | disclosed |
| US-20140231729-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, INSULATING FILM, COLOR FILTER, AND DISPLAY DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-08-21 | — | — | US | disclosed |
| US-20140127626-A1 | RESIST COMPOSITION FOR NEGATIVE DEVELOPMENT WHICH IS USED FOR FORMATION OF GUIDE PATTERN, GUIDE PATTERN FORMATION METHOD, AND METHOD FOR FORMING PATTERN ON LAYER CONTAINING BLOCK COPOLYMER | RIKEN (JP) | 2014-05-08 | — | — | US | disclosed |
| EP-2725423-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, INSULATING FILM, COLOR FILTER, AND DISPLAY DEVICE | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2014-04-30 | — | — | EP | disclosed |
| US-20130168829-A1 | PHENOLIC RESIN COMPOSITION, AND METHODS FOR MANUFACTURING CURED RELIEF PATTERN AND SEMICONDUCTOR | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2013-07-04 | — | — | US | disclosed |
| US-20090123838-A1 | CATHODE SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-05-14 | — | — | US | disclosed |