SCHEMBL30089720

SCHEMBL30089720

COc1ccc(-c2nc(-c3ccccc3)c(-c3ccccc3)n2C2(c3ccc(OC)cc3)N=C(c3ccccc3)C(c3ccccc3)=N2)cc1

nearest known ligand 0.50

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.47
NPSR1 Q6W5P4 2/20 0.47
KDM4E B2RXH2 1/20 0.47
ALDH1A1 P00352 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
L3MBTL1 Q9Y468 1/20 0.47
AKT1 P31749 6/20 0.43
AKT2 P31751 6/20 0.43
MAPT P10636 2/20 0.40
GAA P10253 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
TP53 P04637 1/20 0.40
ADORA3 P0DMS8 1/20 0.40
ADORA1 P30542 1/20 0.40
ADORA2A P29274 1/20 0.39
TNK2 Q07912 1/20 0.39
DPP4 P27487 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16503665 0.88 AKT1 (0.35) TDP1AKT1AKT2
SCHEMBL1613142 0.86 BCHE (0.35) KDM4EALDH1A1TDP1L3MBTL1AKT1
SCHEMBL31734214 0.84 KDM4E (0.43) LMNAKDM4EL3MBTL1AKT1AKT2
SCHEMBL17133351 0.84 KDM4E (0.48) LMNANPSR1KDM4EALDH1A1TDP1
SCHEMBL16503705 0.84 BCHE (0.34) KDM4EALDH1A1L3MBTL1AKT1AKT2
SCHEMBL16746556 0.82 MGAM (0.42) AKT1AKT2GAADPP4
SCHEMBL21579082 0.82 TDP1 (0.39) ALDH1A1TDP1AKT1AKT2ADORA3
SCHEMBL14524165 0.81 AKT1 (0.45) KDM4EALDH1A1AKT1AKT2GAA
SCHEMBL17133337 0.81 KDM4E (0.44) LMNANPSR1KDM4EALDH1A1TDP1
SCHEMBL16503670 0.81 AKT1 (0.34) AKT1AKT2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023283915-A1 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD OF PRODUCING WIRING BOARD SHOWA DENKO MATERIALS CO., LTD. (JP) 2023-01-19 WO disclosed
WO-2023284643-A1 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD OF PRODUCING WIRING BOARD SHOWA DENKO MATERIALS CO., LTD. (JP) 2023-01-19 WO disclosed