SCHEMBL30104503

SCHEMBL30104503

C=C(C)c1ccc(C(=C)C)c(C)c1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SORT1 Q99523 1/20 0.38
PRSS1 P07477 1/20 0.35
PRSS2 P07478 1/20 0.35
PRSS3 P35030 1/20 0.35
ALDH1A1 P00352 2/20 0.32
CES2 O00748 1/20 0.32
CES1 P23141 1/20 0.32
HTT P42858 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
ALOX5 P09917 1/20 0.32
PTGS1 P23219 1/20 0.32
PTGS2 P35354 1/20 0.32
MAPT P10636 2/20 0.31
LMNA P02545 1/20 0.31
GAA P10253 1/20 0.31
RXRA P19793 2/20 0.31
MEN1 O00255 2/20 0.31
KMT2A Q03164 2/20 0.31
CYP26A1 O43174 1/20 0.31
ABCB11 O95342 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1819662 1.00 SORT1 (0.38) SORT1PRSS1PRSS2PRSS3ALDH1A1
SCHEMBL23153700 0.85 PRSS1 (0.41) SORT1PRSS1PRSS2PRSS3ALDH1A1
SCHEMBL10415154 0.85 SORT1 (0.41) SORT1ALDH1A1CES2CES1HTT
SCHEMBL1553967 0.84 SORT1 (0.37) SORT1PRSS1PRSS2PRSS3ALDH1A1
SCHEMBL30969109 0.84 SORT1 (0.37) SORT1PRSS1PRSS2PRSS3ALDH1A1
SCHEMBL29434188 0.83 SORT1 (0.39) SORT1MAPTLMNAIKBKETBK1
SCHEMBL1363337 0.83 PRSS1 (0.52) PRSS1PRSS2PRSS3ALDH1A1CES2
SCHEMBL4511056 0.83 SORT1 (0.39) SORT1MAPTLMNAIKBKETBK1
SCHEMBL31484336 0.83 PRSS1 (0.52) PRSS1PRSS2PRSS3ALDH1A1CES2
SCHEMBL19195199 0.83 SORT1 (0.50) SORT1ALDH1A1CES2CES1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119219813-A Curable resin composition, cured product, prepreg, circuit board, laminated film, semiconductor sealing material, and semiconductor device DIC株式会社 2024-12-31 CN disclosed
CN-113727970-B Maleimide, curable resin composition, and cured product DIC株式会社 2024-11-15 CN disclosed
CN-113767130-B Curable resin composition DIC株式会社 2024-09-20 CN disclosed
CN-118255955-A Resin, curable resin composition, cured product, resin material for solder resist, insulating material, and resist member DIC株式会社 2024-06-28 CN disclosed
CN-113748149-B Curable resin composition DIC株式会社 2024-05-24 CN disclosed
CN-115348977-B Curable resin, curable resin composition, and cured product DIC株式会社 2023-11-21 CN disclosed
CN-113728030-B Curable resin composition DIC株式会社 2023-08-15 CN disclosed
CN-113748152-B Curable resin composition DIC株式会社 2023-08-15 CN disclosed
CN-113767117-B Curable resin composition DIC株式会社 2023-08-15 CN disclosed
WO-2023089976-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT DIC株式会社 2023-05-25 WO disclosed
WO-2023008079-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT DIC株式会社 2023-02-02 WO disclosed