SCHEMBL301053

SCHEMBL301053

COC(OC)(C(=O)c1ccc(CS)cc1)c1ccc(SC)cc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES1 P23141 1/20 0.48
EPHX2 P34913 1/20 0.45
NR1H4 Q96RI1 1/20 0.45
PLK1 P53350 1/20 0.40
SMN1; SMN2 Q16637 5/20 0.37
ALDH1A1 P00352 2/20 0.37
TSHR P16473 2/20 0.37
MAPK1 P28482 1/20 0.37
TAS1R3 Q7RTX0 1/20 0.36
TAS1R1 Q7RTX1 1/20 0.36
TNF P01375 1/20 0.35
MAPT P10636 3/20 0.34
HTT P42858 2/20 0.34
KDM4E B2RXH2 1/20 0.34
NPC1 O15118 1/20 0.34
RAB9A P51151 1/20 0.34
HAO1 Q9UJM8 1/20 0.34
IDO1 P14902 1/20 0.33
TAS2R14 Q9NYV8 1/20 0.33
SLC6A4 P31645 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL275573 0.89 CES1 (0.59) CES1EPHX2NR1H4PLK1SMN1; SMN2
SCHEMBL1470523 0.81 CES1 (0.73) CES1EPHX2NR1H4PLK1SMN1; SMN2
SCHEMBL14198647 0.78 CES1 (0.48) CES1EPHX2NR1H4PLK1SMN1; SMN2
SCHEMBL18790833 0.76 CES1 (0.59) CES1EPHX2NR1H4SMN1; SMN2ALDH1A1
SCHEMBL21784944 0.76 CES1 (0.59) CES1PLK1SMN1; SMN2ALDH1A1TAS1R3
SCHEMBL18790834 0.75 CES1 (0.57) CES1EPHX2NR1H4PLK1TSHR
SCHEMBL21784937 0.74 CES1 (0.56) CES1PLK1ALDH1A1TAS1R3TAS1R1
SCHEMBL14020432 0.73 CES1 (0.51) CES1SMN1; SMN2ALDH1A1MAPK1TAS1R3
SCHEMBL13231626 0.72 EPHX2 (0.44) EPHX2NR1H4MAPTHTTNPC1
SCHEMBL1145845 0.72 IDO1 (0.52) MAPTNPC1RAB9AIDO1SLC6A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8278387-B2 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
US-8273520-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
EP-0949540-B1 Method for producing lithographic printing plate suitable for laser scan exposure, and photopolymerizable composition FUJIFILM CORP (JP) 2012-05-02 EP disclosed
US-20120082836-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2012-04-05 US disclosed
US-20120082836-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2012-04-05 US disclosed
US-8133654-B2 Laser-decomposable resin composition and laser-decomposable pattern-forming material and flexographic printing plate precursor of laser engraving type using the same FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-7879535-B2 A fine conductive metal pattern superior in heat resistance, adhesion property to a base surface and durability on a polyimide surface; simplification; grafting an acylic monomer on polyimide to interact with electroless plating catalyst; reduction of metal salt in defined pattern; printed circuit FUJIFILM CORPORATION (JP) 2011-02-01 US disclosed
US-7790348-B2 Decomposable resin composition and flexographic printing plate precursor using the same FUJIFILM CORPORATION (JP) 2010-09-07 US disclosed
US-7771916-B2 Polymerizable composition and planographic printing plate precursor FUJIFILM CORPORATION (JP) 2010-08-10 US disclosed
US-7741005-B2 A planographic printing plate precursor comprising: an aluminum support; and a photosensitive layer including a polymerization initiator, a polymerizable compound and a binder polymer; an oxygen barrier layer; and a protective layer including a filler; capable of image formation FUJIFILM CORPORATION (JP) 2010-06-22 US disclosed
US-20080194762-A1 Polyurethanes, acryl resins, and metal (cobalt, nickel, palladium, and/or ruthenium); engravable flexographic printing plate precursor FUJIFILM CORPORATION (JP) 2008-08-14 US disclosed
US-20080182205-A1 Polymer having polymerizable group, polymerizable composition, planographic printing plate precursor, and planographic printing method using the same KUNITA KAZUTO 2008-07-31 US disclosed
EP-1939244-A2 Laser-decomposable resin composition, and pattern-forming material and laser-engravable flexographic printing plate precursor using the same FUJIFILM Corporation (JP) 2008-07-02 EP disclosed
US-7381517-B2 Curable composition and image forming material containing the same FUJIFILM CORPORATION (JP) 2008-06-03 US disclosed
US-20080096132-A1 mixing a polymerizable monomer in which acrylonitrile accounts for 70% by weight or more of a total of the polymerizable monomer, water and an alkali metal persulfate polymerization initiator to conduct emulsion polymerization; distilling off unpolymerized monomers; chemical resistance film, gas barrier FUJIFILM CORPORATION 2008-04-24 US disclosed
US-7351773-B2 Polymerizable composition FUJIFILM CORPORATION (JP) 2008-04-01 US disclosed
US-20080070154-A1 DECOMPOSABLE RESIN COMPOSITION AND PATTERN-FORMING MATERIAL INCLUDING THE SAME FUJIFILM CORPORATION (JP) 2008-03-20 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed
US-20080044763-A1 Resin composition and thermo/photosensitive composition FUJIFILM CORPORATION 2008-02-21 US disclosed
US-20080038663-A1 butadiene-styrene copolymer binder and a compound which undergoes decarboxylation due to heat, generates carbon dioxide gas, assists thermal decomposition of the coexisting binder polymer; high engraving sensitivity with low laser energy; forming flexographic printing plate FUJIFILM CORPORATION (JP) 2008-02-14 US disclosed