Sugi Predict

Sugi Predict / Compounds / SCHEMBL275573

SCHEMBL275573

SCHEMBL275573

COC(OC)(C(=O)c1ccc(SC)cc1)c1ccc(SC)cc1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CES1 P23141 1/20 0.59
▸ PLK1 P53350 1/20 0.49
▸ ALDH1A1 P00352 5/20 0.44
▸ SMN1; SMN2 Q16637 4/20 0.44
▸ TSHR P16473 3/20 0.44
▸ MAPK1 P28482 1/20 0.44
▸ EPHX2 P34913 1/20 0.43
▸ NR1H4 Q96RI1 1/20 0.43
▸ MAPT P10636 4/20 0.40
▸ TAS1R3 Q7RTX0 1/20 0.40
▸ TAS1R1 Q7RTX1 1/20 0.40
▸ GAA P10253 2/20 0.39
▸ ALOX15 P16050 2/20 0.39
▸ HTT P42858 2/20 0.39
▸ HAO1 Q9UJM8 1/20 0.37
▸ RAB9A P51151 3/20 0.36
▸ HPGD P15428 2/20 0.36
▸ MEN1 O00255 2/20 0.36
▸ LMNA P02545 2/20 0.36
▸ KMT2A Q03164 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1470523 0.92 CES1 (0.73) CES1PLK1ALDH1A1SMN1; SMN2TSHR
SCHEMBL14198647 0.89 CES1 (0.48) CES1PLK1ALDH1A1SMN1; SMN2TSHR
SCHEMBL301053 0.89 CES1 (0.48) CES1PLK1ALDH1A1SMN1; SMN2TSHR
SCHEMBL13268944 0.80 CES1 (0.65) CES1ALDH1A1TSHRMAPK1MAPT
SCHEMBL31208574 0.80 CES1 (0.65) CES1ALDH1A1SMN1; SMN2MAPK1EPHX2
SCHEMBL9800584 0.80 CES1 (0.65) CES1ALDH1A1SMN1; SMN2MAPTGAA
SCHEMBL14020432 0.80 CES1 (0.51) CES1ALDH1A1SMN1; SMN2MAPK1MAPT
SCHEMBL18790471 0.79 CES1 (0.62) CES1ALDH1A1MAPK1MAPTALOX15
SCHEMBL22309581 0.79 CES1 (0.62) CES1PLK1ALDH1A1MAPK1MAPT
SCHEMBL10299600 0.79 CES1 (0.62) CES1PLK1ALDH1A1SMN1; SMN2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1403710-B1 Polymerizable composition FUJIFILM CORP (JP) 2015-06-10 — — EP disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 — — US disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 — — US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 — — US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 — — US disclosed
EP-2106906-B1 Relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORP (JP) 2013-08-14 — — EP disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 — — US disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 — — US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 — — US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 — — US disclosed
EP-1839853-A1 Planographic printing plate precursor and stack thereof FUJIFILM Corporation (JP) 2007-10-03 — — EP disclosed
US-20070212883-A1 Method For Forming Surface Graft, Method For Forming Conductive Film, Method For Forming Method Pattern, Method For Forming Multilayer Wiring Board, Surface Graft Material, And Conductive Material FUJIFILM CORPORATION (JP) 2007-09-13 — — US disclosed
US-20070212883-A1 Method For Forming Surface Graft, Method For Forming Conductive Film, Method For Forming Method Pattern, Method For Forming Multilayer Wiring Board, Surface Graft Material, And Conductive Material FUJIFILM CORPORATION (JP) 2007-09-13 — — US disclosed
US-7232644-B2 Polymerizable composition and negative-working planographic printing plate precursor using the same FUJIFILM CORPORATION (JP) 2007-06-19 — — US disclosed
US-7232644-B2 Polymerizable composition and negative-working planographic printing plate precursor using the same FUJIFILM CORPORATION (JP) 2007-06-19 — — US disclosed
WO-2007052846-A1 EPOXY RESIN COMPOSITION, CONDUCTIVE FILM FORMING METHOD, CONDUCTIVE PATTERN FORMING METHOD, AND MULTILAYERED WIRING BOARD MANUFACTURING METHOD FUJIFILM CORPORATION (JP) 2007-05-10 — — WO disclosed
US-20070072113-A1 Photosensitive composition, and lithographic printing plate precursor and image-recording method using the same FUJI PHOTO FILM CO., LTD. 2007-03-29 — — US disclosed
US-20070072113-A1 Photosensitive composition, and lithographic printing plate precursor and image-recording method using the same FUJI PHOTO FILM CO., LTD. 2007-03-29 — — US disclosed
US-7179582-B2 Radical polymerizable composition and lithographic printing plate precursor using the same FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 — — US disclosed
US-7179582-B2 Radical polymerizable composition and lithographic printing plate precursor using the same FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 — — US disclosed