⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1535731 | 0.89 | LMNA (0.42) | — | |
| Hydrochloric Acid SCHEMBL18059974 | 0.86 | LMNA (0.40) | — | |
| SCHEMBL10062208 | 0.84 | LMNA (0.41) | — | |
| SCHEMBL3453066 | 0.83 | — | — | |
| SCHEMBL2094168 | 0.80 | LMNA (1.00) | — | |
| SCHEMBL9459 | 0.80 | — | — | |
| SCHEMBL16767876 | 0.79 | ODC1 (0.39) | — | |
| SCHEMBL11897932 | 0.79 | — | — | |
| SCHEMBL3504284 | 0.78 | — | — | |
| SCHEMBL6677962 | 0.78 | LMNA (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 132 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250224675-A1 | RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-07-10 | — | — | US | disclosed |
| CN-111381447-B | Photosensitive resin composition, laminate, and pattern forming method | 信越化学工业株式会社 | 2024-03-08 | — | — | CN | disclosed |
| CN-109388023-B | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming method | 信越化学工业株式会社 | 2023-12-22 | — | — | CN | disclosed |
| US-11780946-B2 | Alternating copolymer, method of producing alternating copolymer, method of producing polymeric compound, and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-10 | — | — | US | disclosed |
| CN-109388022-B | Silicone-structure-containing polymer, photosensitive resin composition, photosensitive resin coating layer, photosensitive dry film, laminate, and pattern forming method | 信越化学工业株式会社 | 2023-07-28 | — | — | CN | disclosed |
| US-11709425-B2 | Resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-07-25 | — | — | US | disclosed |
| US-11703756-B2 | Resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-07-18 | — | — | US | disclosed |
| US-11650497-B2 | Resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-05-16 | — | — | US | disclosed |
| US-11635686-B2 | Resist composition, method of forming resist pattern, and compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-25 | — | — | US | disclosed |
| US-11586111-B2 | Resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-02-21 | — | — | US | disclosed |
| US-20100015553-A1 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD (JP) | 2010-01-21 | — | — | US | disclosed |
| US-20090317743-A1 | Resist composition for immersion exposure, method of forming resist pattern, and flourine-containing polymeric compound | TOKYO OHKA KOGYO CO., LTD. | 2009-12-24 | — | — | US | disclosed |
| US-20090312573-A1 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND, AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-12-17 | — | — | US | disclosed |
| US-20090269694-A1 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-10-29 | — | — | US | disclosed |
| US-20090214982-A1 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-08-27 | — | — | US | disclosed |
| EP-2093213-A1 | Positive resist composition, method of forming resist pattern, and polymeric compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-08-26 | — | — | EP | disclosed |
| CN-101387831-A | Chemically amplified negative resist composition and pattern forming method | SHINETSU CHEMICAL CO (JP) | 2009-03-18 | — | — | CN | disclosed |
| CN-101299131-A | Preparation of chemical reinforced type resist | SHINETSU CHEMICAL CO (JP) | 2008-11-05 | — | — | CN | disclosed |
| US-20080020290-A1 | Negative resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-01-24 | — | — | US | disclosed |
| CN-1825206-A | Negative resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2006-08-30 | — | — | CN | disclosed |