Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | DNM1 | Q05193 | 2/20 | 0.39 |
| ▸ | SMPD1 | P17405 | 3/20 | 0.37 |
| ▸ | FFAR1 | O14842 | 2/20 | 0.37 |
| ▸ | FFAR4 | Q5NUL3 | 1/20 | 0.37 |
| ▸ | GPR84 | Q9NQS5 | 3/20 | 0.36 |
| ▸ | FDPS | P14324 | 3/20 | 0.36 |
| ▸ | SPHK1 | Q9NYA1 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 2/20 | 0.36 |
| ▸ | ZDHHC7 | Q9NXF8 | 1/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28522054 | 1.00 | LMNA (0.40) | LMNADNM1SMPD1FFAR1FFAR4 | |
| SCHEMBL31131434 | 0.98 | LMNA (0.37) | LMNADNM1SMPD1FFAR1FFAR4 | |
| SCHEMBL29139787 | 0.96 | LMNA (0.43) | LMNADNM1SMPD1FFAR1FFAR4 | |
| SCHEMBL9605657 | 0.96 | LMNA (0.43) | LMNADNM1SMPD1FFAR1FFAR4 | |
| SCHEMBL27361548 | 0.96 | LMNA (0.43) | LMNADNM1SMPD1FFAR1FFAR4 | |
| SCHEMBL28367128 | 0.96 | LMNA (0.43) | LMNADNM1SMPD1FFAR1FFAR4 | |
| SCHEMBL31131432 | 0.96 | LMNA (0.43) | LMNADNM1SMPD1FFAR1FFAR4 | |
| SCHEMBL4451467 | 0.96 | LMNA (0.43) | LMNADNM1SMPD1FFAR1FFAR4 | |
| SCHEMBL31174518 | 0.96 | LMNA (0.43) | LMNADNM1SMPD1FFAR1FFAR4 | |
| SCHEMBL1260513 | 0.96 | LMNA (0.43) | LMNADNM1SMPD1FFAR1FFAR4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115558334-A | Ink composition, circuit board containing ink composition, application of ink composition and method for electroplating through hole | 深圳市容大感光科技股份有限公司 | 2023-01-03 | — | — | CN | disclosed |