SCHEMBL302001

SCHEMBL302001

CCCCCCCCC[CH]CCOc1ccccc1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 2/20 0.59
MLNR O43193 1/20 0.55
NR1I2 O75469 1/20 0.55
ESR1 P03372 1/20 0.55
NR3C1 P04150 1/20 0.55
PGR P06401 1/20 0.55
ADRB2 P07550 1/20 0.55
CHRM2 P08172 1/20 0.55
ADRB1 P08588 1/20 0.55
HTR1A P08908 1/20 0.55
ADRA2A P08913 1/20 0.55
ADORA3 P0DMS8 1/20 0.55
CHRM1 P11229 1/20 0.55
DRD2 P14416 1/20 0.55
ADRA2B P18089 1/20 0.55
ADRA2C P18825 1/20 0.55
CHRM3 P20309 1/20 0.55
MAOA P21397 1/20 0.55
CNR1 P21554 1/20 0.55
SLC6A2 P23975 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10423351 0.98 LTA4H (0.61) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL3667595 0.93 LTA4H (0.61) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL15859352 0.84 LTA4H (0.66) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL15859351 0.84 LTA4H (0.66) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL5491778 0.84 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL4579778 0.84 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL64327 0.84 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL18139179 0.84 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL6054693 0.84 LTA4H (0.53) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL25205847 0.83 LTA4H (0.81) LTA4HMLNRNR1I2ESR1NR3C1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6312799-B1 COPOLYMER OF (OPTIONAL ALKYL OR DIALKYL)PHENOXY(ALKOXY)ALKYL (METH)ACRYLATE NITTO DENKO CORPORATION (JP) 2001-11-06 US claimed
EP-0989174-A1 Adhesive composition NITTO DENKO CORPORATION (JP) 2000-03-29 EP claimed
US-5137936-A Method for packaging electronic parts and adhesive for use in said method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1992-08-11 US claimed
EP-2404739-A1 Durable hyrophobic structured surface 3M Innovative Properties Co. (US) 2012-01-11 EP disclosed
EP-0989175-B1 Thermosetting adhesive NITTO DENKO CORP (JP) 2004-05-12 EP disclosed
US-6312799-B1 COPOLYMER OF (OPTIONAL ALKYL OR DIALKYL)PHENOXY(ALKOXY)ALKYL (METH)ACRYLATE NITTO DENKO CORPORATION (JP) 2001-11-06 US disclosed
US-6261685-B1 MULTILAYER NITTO DENKO CORPORATION (JP) 2001-07-17 US disclosed
US-6108062-A Polymer dispersion-type liquid crystal optical device and method for producing the same DAI NIPPON PRINTING CO., LTD. (JP) 2000-08-22 US disclosed
EP-0989175-A1 Thermosetting adhesive NITTO DENKO CORPORATION (JP) 2000-03-29 EP disclosed
EP-0989174-A1 Adhesive composition NITTO DENKO CORPORATION (JP) 2000-03-29 EP disclosed
US-5843332-A Polymer dispersion-type liquid crystal optical device and method for producing the same DAI NIPPON PRINTING CO., LTD. (JP) 1998-12-01 US disclosed
US-5479278-A Method of making a polymer dispersed liquid crystal by electrodeposition DAI NIPPON PRINTING CO., LTD. (JP) 1995-12-26 US disclosed
US-5427642-A Painting the mixture of monofunctional and bifunctional photo/and thermosetting resins, stearamide, curing agents and additives to board; exposure to light, pressing, soldering and heating MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1995-06-27 US disclosed
EP-0378233-B1 An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 1994-12-28 EP disclosed
US-5137936-A Method for packaging electronic parts and adhesive for use in said method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1992-08-11 US disclosed
EP-0378233-A2 An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1990-07-18 EP disclosed