SCHEMBL30210229

SCHEMBL30210229

CC1(OC(=O)C2CC3CC2CC3OC(=O)C2CC3CC2C2C4C=CC(C4)C32)CCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30209872 0.93
SCHEMBL30209919 0.90 SCN1A (0.32)
SCHEMBL30209805 0.90 SCN1A (0.32)
SCHEMBL30209910 0.89 SCN1A (0.32)
SCHEMBL30209916 0.89
SCHEMBL30695938 0.81 LMNA (0.33)
SCHEMBL30209958 0.81 KDM4E (0.30)
SCHEMBL30209973 0.81
SCHEMBL30210000 0.79
SCHEMBL30209814 0.78 CYP19A1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11886119-B2 Material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate MITSUI CHEMICALS, INC. (JP) 2024-01-30 US disclosed
US-20230185195-A1 MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2023-06-15 US disclosed
US-11599025-B2 Resin material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate MITSUI CHEMICALS, INC. (JP) 2023-03-07 US disclosed