SCHEMBL30220142

SCHEMBL30220142

CCc1c(O)ccc2ccc(O)cc12

nearest known ligand 0.47

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 9/20 0.45
ESR2 Q92731 8/20 0.45
CYP1A2 P05177 1/20 0.42
CYP2C9 P11712 1/20 0.42
CYP2C19 P33261 1/20 0.42
HSD17B10 Q99714 1/20 0.42
MCL1 Q07820 1/20 0.42
RAD52 P43351 1/20 0.41
KDM4E B2RXH2 2/20 0.41
MAPT P10636 2/20 0.41
TDP1 Q9NUW8 1/20 0.41
ALDH1A1 P00352 1/20 0.40
GAA P10253 1/20 0.40
TAAR1 Q96RJ0 1/20 0.40
ESRRB O95718 2/20 0.39
ESRRA P11474 2/20 0.39
HSD17B3 P37058 1/20 0.39
MTNR1A P48039 1/20 0.38
MTNR1B P49286 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2185013 1.00 ESR1 (0.45) ESR1ESR2CYP1A2CYP2C9CYP2C19
SCHEMBL15789381 0.88 ESR1 (0.45) ESR1ESR2CYP1A2CYP2C9CYP2C19
SCHEMBL597071 0.83 HSD17B10 (0.61) ESR1ESR2CYP1A2CYP2C9CYP2C19
SCHEMBL29746434 0.83 HSD17B10 (0.61) ESR1ESR2CYP1A2CYP2C9CYP2C19
SCHEMBL3951898 0.82 TRPA1 (0.55) ESR1ESR2CYP1A2CYP2C9CYP2C19
SCHEMBL18328319 0.82 TRPA1 (0.45) ESR1ESR2CYP1A2CYP2C9CYP2C19
SCHEMBL11303615 0.80 KDM4E (0.63) ESR1ESR2CYP1A2CYP2C9CYP2C19
SCHEMBL8370420 0.78 KDM4E (0.47) ESR1ESR2CYP1A2CYP2C9CYP2C19
SCHEMBL6125370 0.78 CYP1A2 (0.50) ESR1ESR2CYP1A2CYP2C9CYP2C19
SCHEMBL25540893 0.78 CYP1A2 (0.50) ESR1ESR2CYP1A2CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116209690-B Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin DIC株式会社 2024-09-06 CN disclosed
CN-116209690-A Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin DIC株式会社 2023-06-02 CN disclosed
CN-115873214-A Epoxy resin, photosensitive resin composition, resist film, curable composition, and cured film DIC株式会社 2023-03-31 CN disclosed