SCHEMBL3040317

SCHEMBL3040317

[CH2]CCNCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25318000 0.94
SCHEMBL25320750 0.88 CA12 (0.50)
SCHEMBL3039716 0.80
SCHEMBL25318542 0.78
SCHEMBL3483661 0.76
SCHEMBL25319833 0.76
SCHEMBL16717 0.76
SCHEMBL25317974 0.76 CASP2 (0.48)
SCHEMBL25316514 0.76
SCHEMBL25318160 0.76 CA12 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11982974-B2 Flexible printed material HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2024-05-14 US disclosed
US-20230303404-A1 NANOPARTICLES, DISPERSION OF NANOPARTICLES, AND PRODUCTION METHOD OF NANOPARTICLES TOKYO OHKA KOGYO CO., LTD. (JP) 2023-09-28 US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 US disclosed
CN-116515023-A Composition and cured product 东京应化工业株式会社 2023-08-01 CN disclosed
CN-116514161-A Nanoparticle, nanoparticle dispersion liquid, and method for producing nanoparticle 东京应化工业株式会社 2023-08-01 CN disclosed
US-11326067-B2 Labels HP INDIGO B.V. (NL) 2022-05-10 US disclosed
WO-2021011006-A1 FLEXIBLE PRINTED MATERIAL HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2021-01-21 WO disclosed
US-20210009823-A1 LABELS HP INDIGO B.V. (NL) 2021-01-14 US disclosed
EP-3541880-A1 LABELS HP Indigo B.V. (NL) 2019-09-25 EP disclosed
WO-2018192651-A1 LABELS HP INDIGO B.V. (NL) 2018-10-25 WO disclosed
US-20100215604-A1 Cosmetic Compositions with Chitosan and Silicone Elastomers HENKEL AG & CO. KGAA (DE) 2010-08-26 US disclosed
US-5449714-A Preparation of conductive silicone rubber composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-09-12 US disclosed