Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.56 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28746708 | 1.00 | — | — | |
| SCHEMBL16668528 | 0.97 | — | — | |
| SCHEMBL20648 | 0.97 | — | — | |
| SCHEMBL13611580 | 0.97 | — | — | |
| SCHEMBL28743875 | 0.93 | — | — | |
| Magnesium SCHEMBL31182158 | 0.93 | — | — | |
| SCHEMBL5487434 | 0.93 | — | — | |
| SCHEMBL27631326 | 0.93 | — | — | |
| Methyl Alcohol SCHEMBL14861497 | 0.93 | — | — | |
| SCHEMBL28072039 | 0.93 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119013330-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-11-22 | — | — | CN | disclosed |
| CN-118974115-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-11-15 | — | — | CN | disclosed |
| CN-118974658-A | Photosensitive resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-11-15 | — | — | CN | disclosed |
| CN-116724071-A | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-09-08 | — | — | CN | disclosed |
| CN-116685622-A | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-09-01 | — | — | CN | disclosed |
| CN-116648313-A | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-08-25 | — | — | CN | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |