SCHEMBL30457071

SCHEMBL30457071

CC(C)(C)CC(C)(C)OOOC(=O)OC(C)(C)C

nearest known ligand 0.31

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 1/20 0.31
HDAC2 Q92769 1/20 0.31
HDAC6 Q9UBN7 1/20 0.31
ELANE P08246 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30456931 0.82 ELANE (0.34) HDAC1HDAC2HDAC6ELANE
SCHEMBL30457246 0.79 LMNA (0.32) HDAC1HDAC2HDAC6
SCHEMBL17727755 0.79 ELANE (0.35) HDAC1HDAC2HDAC6ELANE
SCHEMBL18245138 0.78 TSHR (0.31)
SCHEMBL27338241 0.78
SCHEMBL4189933 0.78
SCHEMBL10349870 0.77
SCHEMBL10349669 0.77
SCHEMBL30456994 0.77 HCAR2 (0.31)
SCHEMBL30457370 0.77 HDAC1 (0.32) HDAC1HDAC2HDAC6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024203745-A1 RESIN POWDER AND METHOD FOR PRODUCING SAME 株式会社カネカ 2024-10-03 WO disclosed
WO-2024090484-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2024-05-02 WO disclosed
US-20230323114-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2023-10-12 US disclosed
EP-4183828-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF Kaneka Corporation (JP) 2023-05-24 EP disclosed