Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3177455 | 1.00 | ALDH1A1 (0.33) | ALDH1A1 | |
| SCHEMBL17265817 | 0.96 | ALDH1A1 (0.32) | ALDH1A1 | |
| SCHEMBL25012674 | 0.92 | — | — | |
| SCHEMBL24254932 | 0.92 | ALDH1A1 (0.33) | ALDH1A1 | |
| SCHEMBL7871381 | 0.89 | — | — | |
| SCHEMBL7869985 | 0.88 | — | — | |
| SCHEMBL7863323 | 0.85 | — | — | |
| SCHEMBL7871390 | 0.83 | — | — | |
| SCHEMBL25011944 | 0.81 | ALDH1A1 (0.32) | ALDH1A1 | |
| SCHEMBL7875185 | 0.81 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4674897-A1 | FILM, LAMINATE AND PRECURSOR COMPOSITION, AND COMPOSITION FOR LOWERING THERMAL EXPANSION COEFFICIENT OF POLYIMIDE RESIN | I.S.T Corporation (JP) | 2026-01-07 | — | — | EP | disclosed |
| CN-116891570-A | Polyamic acid, polyimide, metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2023-10-17 | — | — | CN | disclosed |
| CN-113874420-B | Resin film and metal-clad laminate | 日铁化学材料株式会社 | 2023-09-26 | — | — | CN | disclosed |
| CN-116367413-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-116353168-A | Resin laminate, circuit board, electronic component, and electronic device | 日铁化学材料株式会社 | 2023-06-30 | — | — | CN | disclosed |