SCHEMBL306467

SCHEMBL306467

[B].[Mo].[Ni]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL305579 0.87
SCHEMBL8836554 0.87
SCHEMBL11134852 0.87
SCHEMBL30211360 0.87
SCHEMBL32674547 0.87
SCHEMBL57763 0.82
SCHEMBL6992465 0.82
SCHEMBL5754899 0.82
SCHEMBL11047591 0.82
SCHEMBL6992500 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 88 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113416911-B Composite ceramic coating and preparation method and application thereof 广东电网有限责任公司 2022-10-11 CN claimed
CN-113414238-B Molybdenum-nickel-boron metal ceramic material with ultrafine grain oriented distribution and preparation method thereof 陕西理工大学 2022-10-11 CN claimed
CN-113414238-A Ultrafine grain oriented molybdenum-nickel-boron cermet material and preparation method thereof 陕西理工大学 2021-09-21 CN claimed
CN-113416911-A Composite ceramic coating and preparation method and application thereof 广东电网有限责任公司 2021-09-21 CN claimed
US-10753007-B2 Process for indium or indium alloy deposition and article ATOTECH DEUTSCHLAND GMBH (DE) 2020-08-25 US claimed
CN-108138348-B Methods and articles for indium or indium alloy deposition 埃托特克德国有限公司 2020-04-24 CN claimed
EP-3359710-B1 ROCESS FOR INDIUM OR INDIUM ALLOY DEPOSITION ATOTECH DEUTSCHLAND GMBH (DE) 2020-04-08 EP claimed
US-20180298511-A1 PROCESS FOR INDIUM OR INDIUM ALLOY DEPOSITION AND ARTICLE ATOTECH DEUTSCHLAND GMBH 2018-10-18 US claimed
CN-108138348-A Methods and articles for indium or indium alloy deposition 埃托特克德国有限公司 2018-06-08 CN claimed
CN-104752599-B Conductive heat dissipation substrate 财团法人工业技术研究院 2018-01-12 CN claimed
US-9397279-B2 Electric conductive heat dissipation substrate INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2016-07-19 US claimed
US-20150188016-A1 ELECTRIC CONDUCTIVE HEAT DISSIPATION SUBSTRATE INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2015-07-02 US claimed
CN-104752599-A Conductive heat dissipation substrate IND TECH RES INST 2015-07-01 CN claimed
US-20090085173-A1 SIDEWALL PROTECTION LAYER GLOBALFOUNDRIES INC. (KY) 2009-04-02 US claimed
US-20050230262-A1 Electrochemical methods for the formation of protective features on metallized features SEMITOOL, INC. 2005-10-20 US claimed
US-12017297-B2 Method for manufacturing metal matrix composite parts SPIRIT AEROSYSTEMS, INC. (US) 2024-06-25 US disclosed
WO-2024111195-A1 IMAGING DEVICE AND METHOD FOR MANUFACTURING IMAGING DEVICE パナソニックIPマネジメント株式会社 2024-05-30 WO disclosed
EP-0009877-A1 Wear-resistant molybdenum-iron boride alloy and method of making same CATERPILLAR TRACTOR CO. (US) 1980-04-16 EP disclosed
WO-1980000575-A1 WEAR-RESISTANT MOLYBDENUM-IRON BORIDE ALLOY AND METHOD OF MAKING SAME CATERPILLAR TRACTOR CO (US) 1980-04-03 WO disclosed
US-4019910-A TIN, TUNGSTEN, MOLYBDENUM AND COPPER SALTS, A BORON CONTAINING REDUCING AGENT, A HYPOPHOSPHITE THE RICHARDSON CHEMICAL COMPANY (US) 1977-04-26 US disclosed