⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30398210 | 1.00 | — | — | |
| SCHEMBL29372327 | 1.00 | — | — | |
| SCHEMBL29875800 | 1.00 | — | — | |
| SCHEMBL306225 | 0.82 | — | — | |
| SCHEMBL448943 | 0.82 | — | — | |
| SCHEMBL10851311 | 0.82 | — | — | |
| SCHEMBL306467 | 0.82 | — | — | |
| SCHEMBL11643898 | 0.82 | — | — | |
| Methane SCHEMBL7796387 | 0.82 | — | — | |
| SCHEMBL2159814 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 3553 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117961078-B | Nickel-boron doped cobalt substrate layer carbon wave-absorbing material and preparation method thereof | SHAANXI UNIVERSITY OF SCIENCE & TECHNOLOGY (CN) | 2026-05-26 | — | — | CN | claimed |
| WO-2026105022-A1 | A PROCESS FOR METALLISATION AND BONDING OF SILICON CARBIDE SURFACES | Cirrus Materials Science Limited (NZ) | 2026-05-21 | — | — | WO | claimed |
| CN-122033515-A | Low-temperature steel flux-cored wire and preparation method and application thereof | 哈焊所华通（常州）焊业股份有限公司 | 2026-05-15 | — | — | CN | claimed |
| US-20260106362-A1 | QUADRUPOLE MASS FILTERS AND RELATED SYSTEMS AND METHODS | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2026-04-16 | — | — | US | claimed |
| US-20260078495-A1 | METHOD FOR PROVIDING A CONDUCTIVE SURFACE ON A NON-CONDUCTIVE POLYMERIC SURFACE | CIRRUS MAT SCIENCE LIMITED (NZ) | 2026-03-19 | — | — | US | claimed |
| EP-4693392-A1 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT | Niterra Co., Ltd. (JP) | 2026-02-11 | — | — | EP | claimed |
| US-20260018198-A1 | MAGNETIC MEMORY DEVICE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2026-01-15 | — | — | US | claimed |
| EP-4665881-A1 | SURGICAL INSTRUMENT CABLE COATINGS AND SYSTEMS AND METHOD FOR MAKING THE SAME | Covidien LP (US) | 2025-12-24 | — | — | EP | claimed |
| EP-4584421-A1 | METHOD FOR PROVIDING A CONDUCTIVE SURFACE ON A NON-CONDUCTIVE POLYMERIC SURFACE | Cirrus Materials Science Limited (NZ) | 2025-07-16 | — | — | EP | claimed |
| CN-120158634-A | Preparation method and device of nickel-boron intermediate alloy for nickel-based superalloy | 西安稀有金属材料研究院有限公司 | 2025-06-17 | — | — | CN | claimed |
| US-4744504-A | Method of manufacturing a clad tubular product by extrusion | TURNER WILLIAM C (US) | 1988-05-17 | — | — | US | claimed |
| US-4620660-A | Method of manufacturing an internally clad tubular product | TURNER WILLIAM C | 1986-11-04 | — | — | US | claimed |
| US-4621026-A | Process for providing metallic articles and the like with wear-resistant coatings, and improved coated metallic articles and the like | RICHMOND METAL FINISHERS, INC. (US) | 1986-11-04 | — | — | US | claimed |
| US-4618473-A | Iron powder article having improved toughness | GENERAL MOTORS CORPORATION (US) | 1986-10-21 | — | — | US | claimed |
| EP-0129390-A1 | Addition agents for addition of alloying ingredients to molten metals | Shieldalloy Corporation (US) | 1984-12-27 | — | — | EP | claimed |
| US-4451508-A | VANADIUM CARBIDE, NICKEL BORIDE, CALCIUM SILICIDE | UNION CARBIDE CORPORATION (US) | 1984-05-29 | — | — | US | claimed |
| US-4158578-A | HARDNESS, OXIDATION RESISTANCE | KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO (JP) | 1979-06-19 | — | — | US | claimed |
| US-4150177-A | Method for selectively nickeling a layer of polymerized polyester resin | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 1979-04-17 | — | — | US | claimed |
| US-4005988-A | Interlayer for transient liquid phase diffusion bonding | UNITED TECHNOLOGIES CORPORATION (US) | 1977-02-01 | — | — | US | claimed |
| US-3965277-A | Photoformed plated interconnection of embedded integrated circuit chips | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 1976-06-22 | — | — | US | claimed |