⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphine SCHEMBL3264976 | 0.87 | — | — | |
| Phosphine SCHEMBL5484761 | 0.87 | — | — | |
| Phosphine SCHEMBL27613182 | 0.87 | — | — | |
| Phosphine SCHEMBL27626535 | 0.87 | — | — | |
| Phosphine SCHEMBL722469 | 0.87 | — | — | |
| Phosphine SCHEMBL28256494 | 0.87 | — | — | |
| Phosphine SCHEMBL5057683 | 0.87 | — | — | |
| Phosphine SCHEMBL8941779 | 0.87 | — | — | |
| Phosphine SCHEMBL28002219 | 0.87 | — | — | |
| Phosphine SCHEMBL6852575 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1353 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118645438-A | Bonding contact forming method, bonding structure and semiconductor device | 杭州积海半导体有限公司 | 2024-09-13 | — | — | CN | claimed |
| WO-2024156770-A1 | PLATING BATH COMPOSITION FOR PLATING OF PRECIOUS METAL AND A METHOD FOR DEPOSITING A PRECIOUS METAL LAYER | Atotech Deutschland GmbH & Co. KG (DE) | 2024-08-02 | — | — | WO | claimed |
| EP-4407067-A1 | PLATING BATH COMPOSITION FOR PLATING OF PRECIOUS METAL AND A METHOD FOR DEPOSITING A PRECIOUS METAL LAYER | Atotech Deutschland GmbH & Co. KG (DE) | 2024-07-31 | — | — | EP | claimed |
| CN-113169125-B | Warp compensated bonding structure including support chip and three-dimensional memory chip | 桑迪士克科技有限责任公司 | 2024-05-28 | — | — | CN | claimed |
| CN-117801513-A | Preparation method of multifunctional conductive rubber | 上海航天设备制造总厂有限公司 | 2024-04-02 | — | — | CN | claimed |
| US-11948888-B2 | Semiconductor device | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2024-04-02 | — | — | US | claimed |
| US-11935784-B2 | Three-dimensional memory device containing self-aligned bit line contacts and methods for forming the same | SANDISK TECHNOLOGIES LLC (US) | 2024-03-19 | — | — | US | claimed |
| CN-116918064-A | Three-dimensional memory device including self-aligned bit line contacts and method of forming the same | 桑迪士克科技有限责任公司 | 2023-10-20 | — | — | CN | claimed |
| US-11764145-B2 | Wiring structure having double capping structure, manufacturing method thereof, and integrated circuit chip having the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2023-09-19 | — | — | US | claimed |
| US-20230067527-A1 | SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2023-03-02 | — | — | US | claimed |
| US-20030119317-A1 | Semiconductor device and production method therefor | SONY CORPORATION (JP) | 2003-06-26 | — | — | US | claimed |
| US-20030072928-A1 | Self-aligned corrosion stop for copper C4 and wirebond | GLOBALFOUNDRIES U.S. INC. | 2003-04-17 | — | — | US | claimed |
| US-6528185-B2 | Electrolessly depositing on copper and copper alloys a ternary amorphous-microcrystalline cobalt alloy of cobalt, tungsten and phosphorus from an aqueous bath to achieve a barrier layer to impede the migration of copper atoms to the overplate | HONG KONG POLYTECHNIC UNIVERSITY (HK) | 2003-03-04 | — | — | US | claimed |
| US-6479384-B2 | Process for fabricating a semiconductor device | SONY CORPORATION (JP) | 2002-11-12 | — | — | US | claimed |
| US-20020160222-A1 | Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles | HONG KONG POLYTECHNIC UNIVERSITY, THE (HK) | 2002-10-31 | — | — | US | claimed |
| US-20020066671-A1 | Seed layer deposition | SHIPLEY COMPANY, L.L.C. (US) | 2002-06-06 | — | — | US | claimed |
| EP-1201786-A2 | Seed layer deposition | Shipley Company LLC (US) | 2002-05-02 | — | — | EP | claimed |
| WO-2001099173-A2 | METHOD OF TREATING A SUBSTRATE | APPLIED MATERIALS, INC. (US) | 2001-12-27 | — | — | WO | claimed |
| US-20010055934-A1 | Method and apparatus for treating a substrate | APPLIED MATERIALS, INC. | 2001-12-27 | — | — | US | claimed |
| US-6258707-B1 | Triple damascence tungsten-copper interconnect structure | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-07-10 | — | — | US | claimed |