⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphine SCHEMBL27626535 | 1.00 | — | — | |
| Phosphine SCHEMBL5014348 | 0.89 | — | — | |
| Phosphine SCHEMBL27702401 | 0.89 | — | — | |
| Phosphine SCHEMBL3264086 | 0.87 | — | — | |
| SCHEMBL1343557 | 0.87 | — | — | |
| Phosphine SCHEMBL306494 | 0.87 | — | — | |
| Phosphine SCHEMBL8941779 | 0.75 | — | — | |
| SCHEMBL8836643 | 0.75 | — | — | |
| Phosphine SCHEMBL7539199 | 0.75 | — | — | |
| SCHEMBL4072519 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024156770-A1 | PLATING BATH COMPOSITION FOR PLATING OF PRECIOUS METAL AND A METHOD FOR DEPOSITING A PRECIOUS METAL LAYER | Atotech Deutschland GmbH & Co. KG (DE) | 2024-08-02 | — | — | WO | claimed |
| EP-4407067-A1 | PLATING BATH COMPOSITION FOR PLATING OF PRECIOUS METAL AND A METHOD FOR DEPOSITING A PRECIOUS METAL LAYER | Atotech Deutschland GmbH & Co. KG (DE) | 2024-07-31 | — | — | EP | claimed |
| US-20200232099-A1 | PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD AND A METHOD FOR DEPOSITING A GOLD LAYER | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2020-07-23 | — | — | US | claimed |
| CN-105702630-B | Semiconductor structure and forming method thereof | 中芯国际集成电路制造(上海)有限公司 | 2020-07-10 | — | — | CN | claimed |
| EP-3144413-B1 | PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD | ATOTECH DEUTSCHLAND GMBH (DE) | 2018-04-25 | — | — | EP | claimed |
| EP-3144413-A1 | PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD | ATOTECH Deutschland GmbH (DE) | 2017-03-22 | — | — | EP | claimed |
| US-9406556-B2 | Method of making an interconnect device | LAM RESEARCH CORPORATION (US) | 2016-08-02 | — | — | US | claimed |
| CN-105702630-A | Semiconductor structure and formation method thereof | 中芯国际集成电路制造(上海)有限公司 | 2016-06-22 | — | — | CN | claimed |
| CN-102471918-B | Electroless deposition solutions and process control | LAM RES CORP | 2015-05-27 | — | — | CN | claimed |
| US-20140099789-A1 | METHOD OF MAKING AN INTERCONNECT DEVICE | LAM RESEARCH CORPORATION (US) | 2014-04-10 | — | — | US | claimed |
| US-20130078808-A1 | ELECTROLESS DEPOSITION SOLUTIONS AND PROCESS CONTROL | KOLICS ARTUR (US) | 2013-03-28 | — | — | US | claimed |
| US-8328919-B2 | Electroless deposition solutions and process control | LAM RESEARCH CORPORATION (US) | 2012-12-11 | — | — | US | claimed |
| EP-2454397-A1 | ELECTROLESS DEPOSITION SOLUTIONS AND PROCESS CONTROL | LAM Research Corporation (US) | 2012-05-23 | — | — | EP | claimed |
| CN-102471918-A | Electroless deposition solutions and process control | LAM RES CORP | 2012-05-23 | — | — | CN | claimed |
| US-20110014361-A1 | ELECTROLESS DEPOSITION SOLUTIONS AND PROCESS CONTROL | LAM RESEARCH CORPORATION | 2011-01-20 | — | — | US | claimed |
| WO-2011008212-A1 | ELECTROLESS DEPOSITION SOLUTIONS AND PROCESS CONTROL | LAM RESEARCH CORPORATION (US) | 2011-01-20 | — | — | WO | claimed |
| US-7741228-B2 | Method for fabricating semiconductor device | PANASONIC CORPORATION (JP) | 2010-06-22 | — | — | US | claimed |
| US-20080299763-A1 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | PANASONIC CORPORATION (JP) | 2008-12-04 | — | — | US | claimed |
| US-12396184-B2 | Semiconductor devices including resistor structures | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-08-19 | — | — | US | disclosed |
| US-20050101130-A1 | Method and tool of chemical doping CoW alloys with Re for increasing barrier properties of electroless capping layers for IC Cu interconnects | APPLIED MATERIALS, INC. | 2005-05-12 | — | — | US | disclosed |