SCHEMBL30669265

SCHEMBL30669265

C=C(C)C(=O)OCCCCCCO[C@H]1CC[C@H](C(=O)O)CC1

nearest known ligand 0.51

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.51
POLB P06746 1/20 0.44
APEX1 P27695 1/20 0.44
HTT P42858 1/20 0.44
TDP1 Q9NUW8 1/20 0.44
THRB P10828 1/20 0.41
ALDH1A1 P00352 1/20 0.36
NAAA Q02083 2/20 0.32
EPHX2 P34913 1/20 0.31
S1PR5 Q9H228 1/20 0.31
PLG P00747 1/20 0.31
PLAT P00750 1/20 0.31
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21868825 0.96 TSHR (0.48) TSHRPOLBAPEX1HTTTDP1
SCHEMBL21868826 0.94 TSHR (0.45) TSHRPOLBAPEX1HTTTDP1
SCHEMBL19792617 0.90 THRB (0.49) TSHRPOLBAPEX1HTTTDP1
SCHEMBL13401005 0.89 TSHR (0.58) TSHRPOLBAPEX1HTTTDP1
SCHEMBL10534860 0.86 TSHR (0.51) TSHRPOLBAPEX1HTTTDP1
SCHEMBL17763326 0.85 TSHR (0.54) TSHRPOLBAPEX1HTTTDP1
SCHEMBL17763327 0.85 TSHR (0.54) TSHRPOLBAPEX1HTTTDP1
SCHEMBL17763325 0.85 TSHR (0.54) TSHRPOLBAPEX1HTTTDP1
SCHEMBL17763324 0.85 TSHR (0.54) TSHRPOLBAPEX1HTTTDP1
SCHEMBL22726277 0.84 TSHR (0.53) TSHRPOLBAPEX1HTTTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117215151-A Preparation method and application of negative high refractive index OC photoresist and photo-curing pattern with good hydrophilic performance 西安思摩威新材料有限公司 2023-12-12 CN claimed
CN-117215151-A Preparation method and application of negative high refractive index OC photoresist and photo-curing pattern with good hydrophilic performance 西安思摩威新材料有限公司 2023-12-12 CN disclosed