SCHEMBL307240

SCHEMBL307240

CC(C)(C(=O)c1ccc(CS)cc1)N1CCOCC1

nearest known ligand 0.63

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.63
TSHR P16473 2/20 0.63
SMN1; SMN2 Q16637 2/20 0.63
MAPK1 P28482 1/20 0.63
HRH3 Q9Y5N1 3/20 0.48
HIF1A Q16665 1/20 0.39
EPAS1 Q99814 1/20 0.39
KDM4E B2RXH2 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
HPGD P15428 3/20 0.39
PKM P14618 1/20 0.39
MLYCD O95822 1/20 0.38
HSP90AA1 P07900 1/20 0.38
HSP90AB1 P08238 1/20 0.38
GAA P10253 1/20 0.38
KMT2A Q03164 1/20 0.38
LMNA P02545 1/20 0.38
MAPT P10636 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8180685 0.89 SMN1; SMN2 (0.62) ALDH1A1TSHRSMN1; SMN2MAPK1HRH3
SCHEMBL13528974 0.89 ALDH1A1 (0.50) ALDH1A1TSHRSMN1; SMN2MAPK1HRH3
SCHEMBL306032 0.87 ALDH1A1 (0.65) ALDH1A1TSHRSMN1; SMN2MAPK1HRH3
SCHEMBL14225072 0.85 ALDH1A1 (0.44) ALDH1A1TSHRSMN1; SMN2MAPK1HRH3
SCHEMBL14900388 0.85 ALDH1A1 (0.46) ALDH1A1TSHRSMN1; SMN2MAPK1HRH3
SCHEMBL3670808 0.84 ALDH1A1 (0.62) ALDH1A1TSHRSMN1; SMN2MAPK1HRH3
SCHEMBL8070009 0.84 ALDH1A1 (0.62) ALDH1A1TSHRSMN1; SMN2MAPK1HRH3
SCHEMBL10117515 0.83 SMN1; SMN2 (0.45) ALDH1A1TSHRSMN1; SMN2MAPK1HRH3
SCHEMBL10226378 0.83 ALDH1A1 (0.68) ALDH1A1TSHRSMN1; SMN2MAPK1HRH3
SCHEMBL2705294 0.83 ALDH1A1 (0.68) ALDH1A1TSHRSMN1; SMN2MAPK1HRH3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 142 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1153935-B1 PHOTOPOLYMERIZABLE RESIN COMPOSITION AND USE THEREOF NIPPON STEEL CHEMICAL CO (JP) 2005-05-25 EP claimed
US-6495298-B1 EXCELS IN RESOLUTION, ADHESION OF PATTERNS, DEVELOPMENT LATITUDE AND CURING; INSULATING FILMS, COLORED FILMS, INKS FOR COLOR FILTERS, RESISTS FOR SEMICONDUCTORS, INSULATING SPACERS FOR TOUCH PANELS NIPPON STEEL CHEMICAL CO., LTD. (JP) 2002-12-17 US claimed
EP-1153935-A1 PHOTOPOLYMERIZABLE RESIN COMPOSITION AND USE THEREOF Nippon Steel Chemical Co., Ltd. (JP) 2001-11-14 EP claimed
US-12038121-B2 Heat conservation-insulating material coated with UV curing-type film and having maximized heat efficiency, and method for manufacturing same SEWOON T&S CO., LTD. (KR) 2024-07-16 US disclosed
US-11667762-B2 UV-initiated reactions in polymeric materials THE GENERAL HOSPITAL CORPORATION (US) 2023-06-06 US disclosed
CN-115004093-A Photothermally curable resin composition, liquid crystal sealing agent comprising same, liquid crystal display panel, and method for producing same 三井化学株式会社 2022-09-02 CN disclosed
CN-115004094-A Sealant for liquid crystal dropping process and manufacturing method of liquid crystal display panel 三井化学株式会社 2022-09-02 CN disclosed
CN-111199694-A Electronic device 三星显示有限公司 2020-05-26 CN disclosed
CN-106459319-B Photocurable sealant compositions, their preparation and their use 亨斯迈先进材料特许(瑞士)有限公司 2020-01-03 CN disclosed
CN-106164206-B Filled polydiorganosiloxane-containing compositions and methods of use thereof 3M创新有限公司 2019-12-10 CN disclosed
US-20170351146-A1 LIQUID CRYSTAL DISPLAY AND MANUFACTURING METHOD THEREOF SAMSUNG DISPLAY CO., LTD. (KR) 2017-12-07 US disclosed
US-20080038663-A1 butadiene-styrene copolymer binder and a compound which undergoes decarboxylation due to heat, generates carbon dioxide gas, assists thermal decomposition of the coexisting binder polymer; high engraving sensitivity with low laser energy; forming flexographic printing plate FUJIFILM CORPORATION (JP) 2008-02-14 US disclosed
WO-2008009575-A2 METHOD OF BONDING CIBA HOLDING INC. (CH) 2008-01-24 WO disclosed
US-20080012887-A1 Image forming method and image forming apparatus FUJIFILM CORPORATION 2008-01-17 US disclosed
US-20070296790-A1 INK JET RECORDING METHOD AND INK JET RECORDING DEVICE FUJIFILM CORPORATION (JP) 2007-12-27 US disclosed
US-20070287788-A1 Repair ink and manufacturing method thereof CHUNGHWA PICTURE TUBES, LTD. (TW) 2007-12-13 US disclosed
US-7279195-B2 Method of forming metal fine particle pattern and method of forming electroconductive pattern FUJIFILM CORPORATION (JP) 2007-10-09 US disclosed
EP-1153935-B1 PHOTOPOLYMERIZABLE RESIN COMPOSITION AND USE THEREOF NIPPON STEEL CHEMICAL CO (JP) 2005-05-25 EP disclosed
US-6495298-B1 EXCELS IN RESOLUTION, ADHESION OF PATTERNS, DEVELOPMENT LATITUDE AND CURING; INSULATING FILMS, COLORED FILMS, INKS FOR COLOR FILTERS, RESISTS FOR SEMICONDUCTORS, INSULATING SPACERS FOR TOUCH PANELS NIPPON STEEL CHEMICAL CO., LTD. (JP) 2002-12-17 US disclosed
EP-1153935-A1 PHOTOPOLYMERIZABLE RESIN COMPOSITION AND USE THEREOF Nippon Steel Chemical Co., Ltd. (JP) 2001-11-14 EP disclosed