SCHEMBL3079124

SCHEMBL3079124

O=C(Oc1ccccc1)C1CCC(C(=O)Oc2ccccc2)CC1

nearest known ligand 0.73

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ELANE P08246 2/20 0.73
KMT2A Q03164 2/20 0.67
SMN1; SMN2 Q16637 2/20 0.67
HTT P42858 1/20 0.67
TDP1 Q9NUW8 1/20 0.67
POLB P06746 2/20 0.62
L3MBTL1 Q9Y468 2/20 0.56
ALDH1A1 P00352 3/20 0.55
RAB9A P51151 3/20 0.53
MEN1 O00255 1/20 0.53
F2 P00734 1/20 0.49
HPGD P15428 1/20 0.47
GAA P10253 1/20 0.47
PDGFRB P09619 1/20 0.47
PDGFRA P16234 1/20 0.47
MAPT P10636 1/20 0.46
CHRNA7 P36544 1/20 0.45
HTR3A P46098 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL525974 1.00 ELANE (0.73) ELANEKMT2ASMN1; SMN2HTTTDP1
SCHEMBL12642500 1.00 ELANE (0.73) ELANEKMT2ASMN1; SMN2HTTTDP1
SCHEMBL3193624 1.00 ELANE (0.73) ELANEKMT2ASMN1; SMN2HTTTDP1
SCHEMBL12370828 1.00 ELANE (0.73) ELANEKMT2ASMN1; SMN2HTTTDP1
Hydrochloric Acid SCHEMBL3866426 0.98 ELANE (0.71) ELANEKMT2ASMN1; SMN2HTTTDP1
SCHEMBL5860076 0.94 ELANE (0.67) ELANEKMT2ASMN1; SMN2HTTTDP1
SCHEMBL27676346 0.92 ELANE (0.70) ELANEKMT2ASMN1; SMN2HTTTDP1
SCHEMBL3168823 0.92 ELANE (0.64) ELANEKMT2ASMN1; SMN2HTTTDP1
SCHEMBL30877928 0.92 KMT2A (0.74) ELANEKMT2ASMN1; SMN2HTTTDP1
SCHEMBL9232274 0.92 KMT2A (0.74) ELANEKMT2ASMN1; SMN2HTTTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7794623-B2 Microelectronic device having liquid crystalline epoxy resins INTEL CORPORATION (US) 2010-09-14 US claimed
US-20080237897-A1 Microelectronic device having liquid crystalline epoxy resins MATAYABAS JAMES CHRISTOPHER 2008-10-02 US claimed
US-7417111-B2 Liquid crystalline epoxy resins INTEL CORPORATION (US) 2008-08-26 US claimed
US-20050224753-A1 melting point that is less than 140 degrees C. and may be liquid crystalline at a temperature greater than 150 degrees C.; include epoxylated trans-stilbenediol and epoxylated 3,3,5,5-tetramethyltrans-stilbenediol INTEL CORPORATION 2005-10-13 US claimed
US-7794623-B2 Microelectronic device having liquid crystalline epoxy resins INTEL CORPORATION (US) 2010-09-14 US disclosed
US-20080237897-A1 Microelectronic device having liquid crystalline epoxy resins MATAYABAS JAMES CHRISTOPHER 2008-10-02 US disclosed
US-7417111-B2 Liquid crystalline epoxy resins INTEL CORPORATION (US) 2008-08-26 US disclosed
US-20050224753-A1 melting point that is less than 140 degrees C. and may be liquid crystalline at a temperature greater than 150 degrees C.; include epoxylated trans-stilbenediol and epoxylated 3,3,5,5-tetramethyltrans-stilbenediol INTEL CORPORATION 2005-10-13 US disclosed